Under-Screen Optical Sensing Module With Grounded Transparent Shielding
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Solution Overview
Problem
The integration of optical sensing modules under mobile phone screens leads to signal interference issues, including electrical noise interference and optical interference, which deteriorate signal-to-noise ratio (SNR) performance and reduce optical signal recognition accuracy.
Innovation Solution
An optical sensing module design incorporating a substrate, light shielding layer, optical sensing chips, light-transmitting layer, and a transparent conducting layer, where the transparent conducting layer is connected to a ground wire to shield interference signals, improving signal accuracy by preventing interference between modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the optical sensing module is integrated under the screen, then the space utilization is improved, but electrical noise interference increases
Solution Approach 1:
A transparent conducting layer is introduced as an intermediary component between the optical sensing chip and the external environment. This layer serves as a shield that blocks electrical noise interference from the screen and other components while allowing optical signals to pass through to the sensing chip, thus resolving the contradiction between space utilization and noise interference
Solution Approach 2:
The harmful electrical noise interference is extracted and blocked by the transparent conducting layer, which is electrically connected to ground. This separates the useful optical signal transmission from the harmful electrical interference, allowing the integrated design to maintain signal quality
2Productivity
If the integration level is increased, then the space efficiency is improved, but signal interference between subsystems increases
Solution Approach 1:
The transparent conducting layer acts as a mediator that enables high-level integration while preventing signal interference. It is positioned between the optical sensing module and the screen assembly, blocking electrical noise from the screen from interfering with the optical sensing signals, thus allowing compact integration without sacrificing signal integrity
3Use of energy by moving object
If the transparent encapsulation system is used, then the optical transmission is improved, but optical interference from light reflection increases
Solution Approach 1:
The transparent conducting layer, which is transparent to light, converts the potential harm of light reflection and optical interference into a benefit by maintaining optical transmission while providing electrical noise shielding. The layer allows useful optical signals to pass through while blocking harmful electrical interference, thus resolving the contradiction between optical transmission and optical interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The transparent conducting layer effectively shields interference signals, enhancing the accuracy of electrical signals generated by the optical sensing module and reducing noise interference, thereby improving overall signal recognition accuracy.
Implementation Method 1
the transparent conducting layer is in contact with the second surface of the light-transmitting layer, and is electrically connected to a ground wire in the substrate; the transparent conducting layer is configured to shield an interference signal from the one or more optical sensing chips
Data Source
AI summary
An optical sensing module and an electronic device are provided. The optical sensing module comprises: a substrate, a light shielding layer, one or more optical sensing chips, a light-transmitting layer, and a transparent conducting layer; the one or more optical sensing chips are arranged above the substrate; the light shielding layer clads a portion of the one or more optical sensing chips without contacting the substrate and the light-transmitting layer, and clads a portion of the light-transmitting layer that excludes a second surface of the light-transmitting layer and an area not in contact with the one or more optical sensing chips; the transparent conducting layer is in contact with the second surface of the light-transmitting layer, and is electrically connected to a ground wire in the substrate; and the transparent conducting layer is configured to shield an interference signal from the one or more optical sensing chips.