Optical Element Mount With Plastic-Release Holding Elements
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Solution Overview
Problem
Existing semiconductor technology apparatuses face challenges in maintaining the precise positioning and shape of optical elements, particularly in EUV range projection systems, due to thermal expansion, leading to decreased imaging quality, and existing foot mounts make it difficult to detach optical elements without damage.
Innovation Solution
A device with elastically deformable cantilever-type holding elements that can be plastically deformed using a defined lever force, allowing easy detachment of optical elements by incorporating a notch for defined deformation and a form-fitting tool for applying the lever force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding is used to secure the optical element in a foot mount, then the optical element is securely accommodated, but the optical element becomes difficult to detach without damage
Solution Approach 1:
The holding elements are designed to change their physical state from elastic deformation during normal operation to plastic deformation during detachment. By applying a defined lever force, the holding elements undergo permanent deformation that releases the optical element, transforming the bonding mechanism from rigid adhesive to可控 plastic deformation.
Solution Approach 2:
The holding elements are designed with dynamic behavior that adapts to operational requirements. During normal operation, they remain elastically deformable to secure the optical element. During detachment, they transition to plastic deformation to release the optical element, providing dynamic adaptability between secure holding and easy removal.
2Reliability
If the feet are designed to bend elastically outward when the optical element expands, then the optical element is protected from deformation and position shift, but the optical element cannot be easily removed
Solution Approach 1:
The holding elements are designed with a defined lever force threshold that distinguishes between elastic and plastic deformation. During normal operation, thermal expansion is accommodated through elastic bending. During removal, applying the defined lever force induces plastic deformation, permanently changing the holding elements' shape to release the optical element.
Solution Approach 2:
The holding elements exhibit dynamic response based on applied force magnitude. Small forces during thermal expansion cause elastic deformation for protection. The defined lever force during removal causes plastic deformation for release, creating dynamic adaptability between protective clamping and easy removal.
3Manufacturing precision
If the holding elements are made resilient to accommodate thermal expansion, then the optical element position and shape are maintained, but the holding elements remain in close contact with the optical element after detachment
Solution Approach 1:
The holding elements are designed with a phase transition from elastic to plastic deformation at a defined lever force threshold. During operation, they maintain elastic resilience for precise position maintenance. During detachment, the defined lever force induces plastic deformation that permanently alters their contact state, enabling easy removal.
Solution Approach 2:
The holding elements dynamically switch between resilient elastic contact during operation and permanently deformed plastic contact during removal. This dynamic behavior allows them to maintain precision during use while enabling easy detachment when the defined lever force is applied.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates damage-free detachment of optical elements by ensuring precise plastic deformation of holding elements, maintaining the integrity of the optical elements and preserving the imaging quality of the semiconductor technology apparatus.
Implementation Method 1
a plurality of holding elements (120), which extend substantially parallel to one another, are elastically deformable in the manner of a cantilever up to their elastic limit
Implementation Method 2
at least part of the holding elements can be plastically deformed when applying a defined lever force in such a way that the free ends are removed from a previously accommodated optical element
Data Source
AI summary
The invention relates to a device for accommodating optical elements of a semiconductor technology apparatus.The device comprises a plurality of holding elements which extend substantially parallel to one another, are elastically deformable in the manner of a cantilever to their elastic limit, and are formed and arranged in such a way that an optical element is connectable for accommodation purposes to the free ends of the holding elements, wherein at least part of the holding elements are plastically deformable when applying a defined lever force in such a way that the free ends are removed from a previously accommodated optical element.The invention further relates to an apparatus comprising a device according to the invention, a tool for applying the defined lever force and its use.