Optical Element Mounting Layout for Thermal Isolation

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Solution Overview

Problem

Existing optical element mounting packages face challenges in efficiently managing heat generated by optical elements, which can lead to deterioration of optical characteristics and deformation of optical components.

Innovation Solution

The proposed optical element mounting package includes a base with a recess that has a first mounting portion for the optical element and a second mounting portion for the optical component, along with a heat radiating portion that reduces heat conduction between the optical element and the optical component.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the optical element and optical component are mounted close to each other in a compact package, then the device size is reduced and integration is improved, but heat conduction between the optical element and optical component increases causing deterioration of optical characteristics

Engineering Contradiction:

Improvepackage sizeVSAvoidheat conduction effect

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The recess bottom surface is divided into functionally distinct zones: a first mounting portion for the optical element, a second mounting portion for the optical component, and an intermediate heat radiating portion. This segmentation spatially separates heat-generating components from heat-sensitive components while maintaining compact integration, thereby reducing heat conduction effects between the optical element and optical component.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat radiating portion acts as an intermediary structure between the optical element and optical component. This intermediate zone with different thermal characteristics interrupts direct heat conduction paths, allowing thermal management while maintaining the compact package structure. The intermediary portion enables close mounting of components without direct thermal coupling.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If heat radiation performance is enhanced through structural modifications, then optical characteristics stability is improved, but device complexity increases

Engineering Contradiction:

Improveoptical characteristics stabilityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat radiating portion is integrated directly into the recess bottom surface structure, merging the heat management function with the mounting structure. This integration achieves effective thermal zoning and heat radiation enhancement without adding separate complex heat dissipation components, thereby maintaining reliability while controlling device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The recess bottom surface serves multiple functions simultaneously: it provides mechanical support for mounting components, creates thermal zoning for heat management, and enables heat radiation pathways. This multi-functionality achieves optical characteristics stability through heat control without requiring additional dedicated structures, thus avoiding increased device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat radiation performance, reduces heat conduction between the optical element and the optical component, and maintains stable optical characteristics by effectively managing heat generated by the optical elements.

Implementation Method 1

a heat radiating portion that reduces heat conduction between the optical element and the optical component

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a heat radiating portion located opposite the second mounting portion with the first mounting portion in between

Methodology Applied

Scientific EffectHeat radiation: Thermal Radiation

Data Source

PatentUS20250183615A1Optical element mounting package, electronic device, and electronic module

Publication Date: 2025.06.05 KYOCERA CORP

AI summary

An optical element mounting package includes a base. The base has a recess and a heat radiating portion. The recess includes a first mounting portion and a second mounting portion. On the first mounting portion, an optical element is mountable, and on the second mounting portion, an optical component is mountable. The heat radiating portion is located opposite the second mounting portion with the first mounting portion in between.