Optical Package Structure Asymmetric Electrode Layout for Large Displays
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Solution Overview
Problem
Conventional mobile communication devices with dominant display screens make it difficult to arrange optical package structures corresponding to the housing, requiring compromises such as holes in the display screen to accommodate them.
Innovation Solution
The optical package structure is designed with a board, electrodes, a light emitter, and an integrated circuit chip, where the light emitter and sensor are aligned with light permeable parts of the housing, and the electrode distribution is optimized to reduce size and improve yield, allowing the optical package to be placed near the housing even when the display screen occupies 80% of the front surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the display screen occupies 80% or more of the front surface, then the display area is increased, but the space for arranging the optical package structure in the housing is reduced
Solution Approach 1:
The patent repositions the optical package structure from the traditional lower portion of the housing to the upper portion, utilizing underutilized space in the housing. This spatial reconfiguration allows the optical components (flash, sensor, iris) to be arranged in the housing without interfering with the large display screen area, effectively resolving the space conflict between display expansion and optical package placement
2Reliability
If the optical package structure is arranged in the housing, then the need for holes in the display screen is eliminated, but the space requirements in the housing increase
Solution Approach 1:
The patent employs a light permeable portion in the housing with specific optical properties to allow light transmission from the flash and sensor to the external environment. This localized optical design enables the optical package to function effectively within the housing constraints, maintaining display screen integrity while accommodating optical components in the available housing space
3Volume of moving object
If the light sensor is positioned closer to the upper edge portion of the board, then the optical package size is reduced, but the wiring complexity increases
Solution Approach 1:
The patent implements an asymmetric electrode distribution pattern on the board, with a greater number of electrodes arranged on the lower edge portion compared to the upper edge portion. This asymmetric configuration optimizes the wiring layout to accommodate the light sensor's repositioned location closer to the upper edge, reducing overall package size while managing wiring complexity through strategic electrode placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the optical package structure to be effectively arranged near the housing, reducing distances and electrode density, thereby improving production yield and accommodating large display screens without compromising the optical package's functionality.
Implementation Method 1
a light emitter (3), an integrated circuit (IC) chip (4), and a light permeable package body (5)... The light emitter and the light sensor of the optical package structure are aligned with the at least one light permeable part of the housing along a normal vector of the front surface
Implementation Method 2
The IC chip is disposed on the board and includes a light sensor and a plurality of connecting pads. The light sensor corresponds in position to the light emitter
Implementation Method 3
The soldering bodies respectively connect the electrodes of the optical package structure to the circuit board so as to electrically couple the light emitter and the IC chip to the circuit board
Data Source
AI summary
An optical package structure of a mobile communication device includes a board, electrodes formed on the board, a light emitter and an IC chip both disposed on the board, and a light permeable package body encapsulating the light emitter and the IC chip. The electrodes are respectively arranged on a lower edge portion and two lateral edge portions of the board, and the number of the electrodes on the lower edge portion is larger than that on any of the two lateral edge portions. The light emitter is electrically coupled to at least one of the electrodes. The IC chip includes a light sensor corresponding in position to the light emitter and connecting pads electrically coupled to the electrodes. A distance from the light sensor to the upper edge portion is less than that to the lower edge portion, and is equal to or less than 250 μm.