Optical Package Structure Fixing Element Outside Interfacial Area
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Solution Overview
Problem
The existing adhesive-based bonding methods for optical package structures face challenges in controlling the adhesive layer thickness and alignment between the lens module and the sensor, leading to potential misalignment and contamination of the sensing region.
Innovation Solution
The optical package structure employs a fixing element outside the interfacial area between the optical component and the sensor, eliminating the need for an adhesive layer and ensuring direct contact, which prevents misalignment and contamination, and is composed of a material opaque to the peak wavelength to reduce light interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an adhesive layer is used to bond the lens module and the sensor, then the bonding process is simplified, but the alignment precision and reliability deteriorate due to thickness control issues and potential contamination
Solution Approach 1:
The patent removes the adhesive layer from the bonding process between the lens module and sensor. By eliminating this intermediate layer, the design achieves direct contact bonding, which resolves the alignment precision issues caused by adhesive thickness variation and eliminates contamination risks from adhesive residue on the sensing region.
Solution Approach 2:
The patent introduces a fixing element as a new intermediary component positioned outside the interfacial area. This fixing element provides mechanical bonding and positioning functions without interfering with the optical path or sensing region, thereby maintaining alignment precision while achieving reliable bonding.
2Ease of manufacture
If an adhesive layer is disposed between the lens module and sensor, then bonding is achieved, but reliability deteriorates due to potential contamination of the sensing region
Solution Approach 1:
The adhesive layer is completely removed from the bonding interface. The fixing element is positioned outside the interfacial area between the lens module and sensor, ensuring that no adhesive material can contaminate the sensing region while still providing the necessary bonding function.
Solution Approach 2:
The fixing element serves as a mediator that performs the bonding function without contacting the sensing region. By positioning it outside the interfacial area, it provides mechanical support and bonding while leaving the optical path and sensing surface clean and uncontaminated.
3Manufacturing precision
If the fixing element is disposed outside the interfacial area, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The fixing element positioned outside the interfacial area serves multiple functions: it provides mechanical bonding between components, establishes precise alignment through its geometric configuration, and maintains structural support without interfering with the optical path. This multi-functionality achieves high alignment precision without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the performance of the optical package structure by preventing misalignment and contamination, improving alignment precision and reducing light interference between components.
Implementation Method 1
The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor
Implementation Method 2
composed of a material opaque to the peak wavelength to reduce light interference
Data Source
AI summary
An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.