Optical Projection Module Heat Dissipation via Semiconductor Substrate
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Solution Overview
Problem
Optical projection modules face heat dissipation challenges due to extensive heat generated by light sources, leading to light distortion.
Innovation Solution
The optical projection module design incorporates parallel slots and reinforcing plates with silical gel infill to efficiently dissipate heat away from the light source, preventing distortion of emitted light beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light source is mounted on the printed circuit board to generate light, then illumination intensity is improved, but heat buildup increases causing light distortion
Solution Approach 1:
The patent extracts the light source from the printed circuit board and mounts it on a separate semiconductor substrate. This separation removes the heat-generating light source away from the PCB, preventing heat buildup that would cause light distortion while maintaining the illumination function.
Solution Approach 2:
The patent introduces a semiconductor substrate as an intermediary component between the light source and the printed circuit board. This intermediary structure allows the light source to be mounted securely while providing thermal management and preventing direct heat transfer to the PCB that would cause distortion.
2Temperature
If heat dissipation structures are added to the optical projection module, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the semiconductor substrate: it serves as the mounting platform for the light source, provides thermal management through its thermal conductivity, and acts as a structural support. This merging of functions achieves effective heat dissipation without adding separate complex heat dissipation structures.
Solution Approach 2:
The semiconductor substrate performs multiple roles simultaneously: mechanical support for the light source, thermal conduction path for heat dissipation, and structural integration with the optical system. This multi-functionality reduces overall device complexity while achieving effective heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces heat buildup, maintaining the projective properties of the optical projection modules by ensuring minimal light distortion and improved heat dissipation.
Implementation Method 1
The slots can be filled with a thermally conductive material, such as silical gel, to facilitate heat dissipation
Data Source
AI summary
An optical projection module with improved heat dissipation efficiency includes a circuit board, a semiconductor substrate mounted on a surface of the circuit board, and a light source and an optical member mounted on a surface of the semiconductor substrate opposite from the circuit board. A hollow area is defined in the circuit board and in the semiconductor substrate to draw heat directly away from the light source and thus avoid physical distortion of the hardware which would otherwise reduce the quality of light beams emitted.