Optical Resonator Coupling for High-Bandwidth Proximity Communication
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Solution Overview
Problem
Current methods for inter-device communication, such as capacitive coupling, face challenges in achieving precise alignment and high-bandwidth communication due to limitations in multi-chip assembly techniques and material flatness variations, making it difficult to transmit large amounts of information between electronic devices like integrated circuit chips.
Innovation Solution
The implementation of optical proximity communication using an optical resonator that optically couples waveguides on two electronic devices, allowing for precise alignment and high-bandwidth data transfer by controlling x-, y-, and z-coordinates, and potentially using doped optical resonators for light amplification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If capacitive coupling is used for proximity communication, then signal density is improved, but alignment precision deteriorates due to multi-chip assembly tolerances
Solution Approach 1:
The patent introduces an optical resonator as an intermediary component that couples optical waveguides from different chips. This resonator acts as a mediator that can tolerate misalignment, converting the direct coupling requirement into a resonant coupling process that is less sensitive to positioning errors.
Solution Approach 2:
The patent replaces the electrical capacitive coupling mechanism with an optical coupling mechanism using waveguides and resonators. This substitution allows for relaxed alignment tolerances because optical resonators can maintain coupling efficiency over larger positional variations compared to direct electrical contacts.
2Ease of manufacture
If pick-and-place assembly is used, then manufacturing cost is reduced, but assembly precision deteriorates
Solution Approach 1:
The optical resonator serves as a compensating intermediary that absorbs the alignment errors introduced by low-precision pick-and-place assembly. The resonant coupling mechanism maintains effective communication despite the several-mil tolerances inherent in cost-effective assembly processes.
3Loss of information
If chip alignment is made more precise, then communication bandwidth is improved, but assembly complexity increases
Solution Approach 1:
The patent replaces the mechanical alignment system with an optical resonant coupling system. This substitution achieves high communication bandwidth through resonant enhancement while avoiding the need for complex mechanical alignment mechanisms, thereby reducing assembly complexity.
4Ease of manufacture
If commercial package materials are used, then manufacturing ease is improved, but flatness variation increases
Solution Approach 1:
The optical resonator acts as an intermediary that compensates for flatness variations in commercial package materials. By using resonant coupling rather than direct contact, the system can maintain effective communication despite the flatness variations inherent in cost-effective commercial materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and high-bandwidth optical proximity communication between electronic devices, overcoming alignment and material limitations, and allowing for seamless data transfer across arrays of chips without the need for opto-electronic conversion.
Implementation Method 1
an optical resonator that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device
Implementation Method 2
potentially using doped optical resonators for light amplification
Data Source
AI summary
An assembly comprising first and second electronic devices and an optical resonator that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. A first portion of an optical resonator is disposed in a pit of the first device to optically couple the optical resonator to the first optical waveguide. A second portion of the optical resonator is disposed in a pit of the second device to optically couple the optical resonator to the second optical waveguide. Thus, the optical resonator optically couples the first optical waveguide to the second optical waveguide.