Optical Semiconductor Device with Integrated Transparent Layer
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Solution Overview
Problem
Current optical semiconductor devices face challenges in enhancing light extraction efficiency and reducing manufacturing costs, particularly in achieving uniform light distribution and minimizing degradation due to blue light emission, while maintaining a compact size and reliable mounting on substrates.
Innovation Solution
The optical semiconductor device incorporates a transparent layer with refractive indices between 1 to 2, metal posts for current conduction, and a sealing layer that exposes end portions of the metal posts, along with a fluorescent layer for wavelength conversion, all integrated on a light emitting layer epitaxially grown on a substrate, simplifying the device configuration and manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor light emitting element is mounted on a substrate with transparent resin sealing, then reliable mounting and protection are achieved, but light extraction efficiency decreases and manufacturing cost increases
Solution Approach 1:
The patent merges the semiconductor light emitting element and the substrate into a single integrated structure, eliminating the need for separate mounting and sealing processes. The substrate serves dual functions as both the mounting base and the sealing enclosure, reducing manufacturing steps and costs while maintaining reliability
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: mechanical support, electrical connection, and optical sealing. This multi-functionality eliminates the need for additional components and simplifies the manufacturing process
2Reliability
If a conventional mounting process with transparent resin sealing is used, then protection is achieved, but light extraction efficiency is reduced
Solution Approach 1:
The patent changes the refractive index parameter of the sealing material by using the substrate material itself (with refractive index matched to the semiconductor layer) instead of transparent resin. This parameter change eliminates refraction losses at interfaces and improves light extraction efficiency while maintaining protective sealing
3Reliability
If multiple separate components are used for mounting and sealing, then reliable connection is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple separate components (mounting structure, sealing structure, and support structure) into a single integrated substrate, significantly reducing device complexity while maintaining connection reliability through direct bonding interfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases light extraction efficiency, reduces thermal resistance, and ensures reliable mounting by minimizing refractive index differences and thermal expansion mismatches, while enabling compact size and cost-effective production with improved light distribution and durability against blue light degradation.
Implementation Method 1
a transparent layer with refractive indices between 1 to 2
Implementation Method 2
a fluorescent layer for wavelength conversion
Implementation Method 3
metal posts for current conduction
Implementation Method 4
a light emitting layer epitaxially grown on a substrate
Data Source
AI summary
According to one embodiment, an optical semiconductor device includes a light emitting layer, a transparent layer, a first metal post, a second metal post and a sealing layer. The light emitting layer includes a first and a second major surface, a first and a second electrode. The second major surface is a surface opposite to the first major surface, and the first electrode and second electrodes are formed on the second major surface. The transparent layer is provided on the first major surface. The first metal post is provided on the first electrode. The second metal post is provided on the second electrode. The sealing layer is provided on the second major surface. The sealing layer covers a side surface of the light emitting layer and seals the first and second metal posts while leaving end portions of the first and second metal posts exposed.