Optical Sensor Chip Multiplexer for Simultaneous Specimen Analysis

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Solution Overview

Problem

Existing optical sensors cannot collectively measure the state of multiple portions of a specimen simultaneously due to the need for sequential switching of objects using an optical switch, limiting their ability to non-destructively assess multiple points simultaneously.

Innovation Solution

An optical sensor chip with a multiplexer and changer units that can receive and modify optical signals based on a specimen's state, allowing multiple chips to be connected and collectively measure various aspects of a specimen through optical fibers, enabling simultaneous analysis of multiple points without the need for sequential switching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an optical switch is used to sequentially switch objects to be measured, then the measurement system can handle multiple objects, but the state of multiple portions of a specimen cannot be collectively measured simultaneously

Engineering Contradiction:
Improveability to measure multiple objectsVSAvoidsequential measurement time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The invention divides the optical signal transmission path into multiple independent channels using optical fibers. Each optical sensor chip has dedicated optical fibers for signal input and output, eliminating the need for sequential switching. Multiple specimens or multiple portions of a specimen can be measured simultaneously through these parallel optical channels.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Optical fibers serve as intermediaries to transmit optical signals between the optical sensor chips and the external measurement system. This intermediary transmission medium enables parallel signal transmission without interference, allowing collective measurement of multiple portions simultaneously while maintaining signal integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If multiple optical sensor chips are connected to collectively measure multiple portions, then simultaneous measurement capability is achieved, but the device complexity increases

Engineering Contradiction:
Improvesimultaneous measurement capabilityVSAvoidnumber of optical sensor chips and connections
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

Each optical sensor chip is designed as a universal module with standardized optical fiber interfaces and consistent functional characteristics. The chips can be interconnected in various configurations (series, parallel, or arbitrary patterns) without requiring different connection methods, simplifying the overall system architecture despite having multiple chips.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Multiple optical sensor chips are merged into a single optical sensor system through optical fiber connections. The chips work together as an integrated system where each chip contributes to measuring a specific portion, and the combined output provides comprehensive measurement data for multiple portions simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If optical fibers are used to connect optical sensor chips, then signal transmission is improved, but the installation complexity increases

Engineering Contradiction:
Improveoptical signal transmission qualityVSAvoidinstallation complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The optical sensor chips are equipped with pre-attached optical fiber interfaces during manufacturing. The optical fibers are preliminarily connected to the chips, and connection patterns are predetermined, which simplifies the installation process. Users only need to follow the predetermined connection scheme without performing complex fiber alignment or connection procedures.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20240402082A1Optical sensor chip, optical sensor system, and measurement method
Publication Date: 2024.12.05 MITSUBISHI ELECTRIC CORP
  • US20240402082A1 patent drawing
  • US20240402082A1 patent drawing
  • US20240402082A1 patent drawing

AI summary

An optical sensor chip includes a spot-size conversion unit to receive a first optical signal from outside, a changer unit to change the first optical signal depending on a state of a specimen, a spot-size conversion unit to output the first optical signal to the outside, a spot-size conversion unit to receive a second optical signal from the outside, a multiplexer unit to multiplex a first optical signal changed by the changer unit depending on the state of the specimen and the second optical signal, and a spot-size conversion unit to output an optical signal multiplexed by the multiplexer unit to the outside.