Optical Sensor Chip Device with Through-Plating Substrate
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Solution Overview
Problem
Current optical sensor devices are bulky and costly due to complex mounting and connection technologies, limiting their miniaturization and integration capabilities, which hinders their application in compact and energy-efficient systems like thermography cameras and security surveillance.
Innovation Solution
The integration of optical sensor chips with corresponding devices on a low packaging level, utilizing a substrate with through-platings and modular design, allowing for precise mechanical positioning and reduced costs, along with the integration of microcontrollers and wake-up sensors, enables a compact and cost-effective configuration for acquiring both visible and infrared spectra.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex mounting and connection technologies are used to integrate optical sensor chips with devices, then reliable electrical connections and precise positioning are achieved, but device size increases and manufacturing cost rises
Solution Approach 1:
The patent merges the mounting function and electrical connection function into a single integrated substrate structure. The substrate simultaneously provides mechanical support, electrical connections via through-platings, and precise positioning features, eliminating the need for separate mounting components and reducing overall device volume while maintaining connection reliability
Solution Approach 2:
The substrate is designed as a multi-functional component that performs multiple roles: mechanical support for optical sensor chips, electrical connection medium through through-platings, positioning reference through precise features, and structural framework for the entire device. This universal component reduces the number of separate parts needed
2Reliability
If complex mounting and connection technologies are used to integrate optical sensor chips with devices, then reliable electrical connections are achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple functions (mounting, electrical connection, positioning) into a single substrate, reducing the number of assembly steps and components. This simplification lowers manufacturing complexity and cost while maintaining reliable electrical connections through the integrated through-plating structure
Solution Approach 2:
The substrate is designed with modular through-platings that can be independently manufactured and assembled. This segmentation allows for standardized, cost-effective manufacturing processes while ensuring reliable electrical connections between the optical sensor chip and external circuitry
3Manufacturing precision
If optical sensor chips are mounted with precise mechanical positioning, then positioning accuracy at micrometer level is achieved, but adjustment and calibration time increases
Solution Approach 1:
The substrate incorporates pre-formed positioning features and through-platings during substrate manufacturing, before the optical sensor chip is mounted. This preliminary preparation of precise mechanical and electrical interfaces eliminates the need for time-consuming on-site adjustment and calibration, achieving micrometer-level positioning accuracy through pre-engineered features
4Volume of moving object
If multiple optical sensor chips are integrated on the same substrate, then space is saved and device compactness increases, but thermal interference between chips may increase
Solution Approach 1:
The substrate is designed with localized thermal management features, including chip-specific heat sinks and thermal vias positioned directly beneath each optical sensor chip. This local thermal management allows multiple chips to be integrated in close proximity while preventing thermal interference between adjacent chips through targeted heat dissipation structures
Data Source
AI summary
An optical sensor chip device and a corresponding production method. The optical sensor chip device includes a substrate having a front side and a rear side; at least one first optical sensor chip for acquiring a first optical spectral range, the chip being attached to the substrate; and a first sealed cavern fashioned above an upper side of the first optical sensor chip. The first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern.