Optical Sensor Package with Lateral Window and Opaque Encapsulation
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Solution Overview
Problem
Existing electronic packages are complex, costly, and face challenges with large dimensions and external electrical connection difficulties due to the need for a mounting plate and specially dimensioned covers, which complicate the integration and insulation of optical detectors and emitters.
Innovation Solution
A simplified electronic package design featuring a substrate wafer with integrated circuit chips, a transparent encapsulation means extending above optical sensors and emitters, and an opaque encapsulation means with a lateral front window, allowing for efficient light radiation diffusion and optical coupling while minimizing the need for complex mounting and external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mounting plate and specially dimensioned cover are used to optically insulate chips, then optical insulation is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the mounting plate and cover into a single substrate wafer structure. The substrate wafer simultaneously serves as the mounting base and the optical insulation enclosure, eliminating the need for separate mounting plates and specially dimensioned covers. This integration maintains optical insulation functionality while significantly reducing structural complexity and the number of assembly steps.
Solution Approach 2:
The substrate wafer is designed to perform multiple functions: it serves as the mechanical support for mounting chips, provides optical insulation through its opaque material, and acts as the structural enclosure. This multi-functional design eliminates the need for separate components dedicated to each function, thereby reducing device complexity while maintaining reliability.
2Reliability
If a mounting plate with separate chambers is used, then optical insulation is provided, but the number of mounting steps increases
Solution Approach 1:
The patent combines multiple mounting functions into a single substrate wafer. Instead of separately mounting chips onto a mounting plate and then attaching a cover, all chips are mounted directly onto the substrate wafer in a single assembly process. The substrate wafer's integrated design allows for simplified chip mounting while maintaining the optical insulation chambers needed for reliable operation.
3Ease of operation
If chips are mounted on a mounting plate with external connections, then electrical connections are established, but external connection difficulties arise
Solution Approach 1:
The patent extracts the electrical connection function from the external mounting structure and integrates it into the substrate wafer itself. The substrate wafer includes integrated electrical connection means that directly connect to the chips, eliminating the need for complex external connection structures. This integration simplifies the connection process while maintaining reliable electrical connectivity.
4Reliability
If a specially dimensioned cover is used, then optical insulation is achieved, but package dimensions become large
Solution Approach 1:
The patent merges the cover function into the substrate wafer structure. The substrate wafer is designed with integrated optical insulation chambers that eliminate the need for a separate specially dimensioned cover. This integration maintains the necessary optical insulation for reliable chip operation while significantly reducing the overall package volume and dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design results in a more cost-effective and compact electronic package that effectively uses light radiation for proximity sensing, reducing complexity and improving electrical connections, enabling efficient optical coupling and protection against external light.
Implementation Method 1
a transparent encapsulation means extending above the optical sensor and the optical emitter
Implementation Method 2
an opaque encapsulation means encapsulating the transparent encapsulation means, this opaque encapsulation means having a front window which is situated above the optical emitter and which is offset laterally relative to the optical sensor
Implementation Method 3
an emitting integrated circuit chip comprising, in a front face, a light radiation optical emitter
Implementation Method 4
a receiving integrated circuit chip comprising, in a front face, at least one light radiation optical sensor
Data Source
AI summary
An electronic package includes a substrate wafer having front and rear faces. An emitting integrated circuit chip is mounted to the front face of the substrate wafer and includes a light radiation optical emitter. A receiving integrated circuit chip is also mounted to the front face of the substrate wafer and includes at least one light radiation optical sensor. A transparent encapsulant extends above the optical sensor and the optical emitter. An opaque encapsulant encapsulates the transparent encapsulant. The opaque encapsulant has a front window situated above the optical emitter and which is offset laterally relative to the optical sensor. The transparent encapsulant accordingly has an uncovered front face situated above the optical emitter and offset laterally relative to the optical sensor. The opaque encapsulant may include an additional front window. The receiving integrated circuit chip further includes a second optical sensor situated opposite the additional front window.