Optical Sensor Package Layout for Compact Light Isolation
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Solution Overview
Problem
The existing optical sensor packages in compact designs face interference from light sources due to the need for blocking frame walls, which increase the package size and hinder efficient integration of components.
Innovation Solution
An optical sensor package with a central interposer mounted between the optical sensor and light source, encapsulated by light-pervious molds, and electrically connected via conductive interconnects, preventing direct light interference while allowing for compact integration of additional electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a blocking frame wall is used to prevent light interference, then light interference is blocked, but the package size increases
Solution Approach 1:
The package is divided into separate functional regions: a sensor region for the optical sensor and a light emitting region for the light source. This spatial segmentation allows light to be blocked at the region boundary without requiring a large centralized blocking structure, thus preventing light interference while maintaining compact package size.
Solution Approach 2:
The patent transitions from a planar layout to a three-dimensional stacked architecture. Electronic components are arranged in multiple layers vertically above the package substrate, with the optical sensor and light source positioned at different heights and horizontal positions. This dimensional change enables compact integration while maintaining sufficient light blocking distance without requiring large lateral blocking structures.
2Area of stationary object
If components are integrated into a compact package, then package size is reduced, but light interference occurs
Solution Approach 1:
The compact package achieves light isolation through segmented spatial arrangement. The sensor region and light emitting region are separated into distinct zones with different vertical and horizontal positions, allowing compact integration while preventing direct light paths between the light source and optical sensor.
Solution Approach 2:
The package substrate and supporting structures serve as intermediary elements that provide both mechanical support and optical isolation. These intermediate structures enable compact component placement while blocking direct light transmission between the light source and optical sensor through their light-absorbing or light-blocking properties.
3Device complexity
If electronic components are integrated on the same substrate, then device complexity is reduced, but light interference increases
Solution Approach 1:
Electronic components are segmented into functionally distinct regions on the package substrate. The optical sensor is positioned in a sensor region while the light source is positioned in a light emitting region, with supporting electronic components distributed in intermediate zones. This regional segmentation simplifies integration by organizing components by function while preventing direct light interference between critical elements.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement to resolve the conflict between integration and light isolation. Components are distributed across multiple vertical layers and horizontal zones, with the optical sensor and light source positioned at different heights and radial distances from the substrate center. This dimensional distribution enables high integration density while maintaining optical isolation through vertical and radial spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces light interference and enables a more compact structure for optical sensor packages, allowing for efficient integration of electronic components without increasing the package size, enhancing performance and functionality.
Implementation Method 1
a first light-pervious encapsulant mold encapsulating the optical sensor and a second light-pervious encapsulant mold encapsulating the light source
Implementation Method 2
a central interposer mounted on the front surface of the package substrate via a support wall and between the optical sensor and the light source, wherein the central interposer and the support wall are light-impervious to prevent the light source from illuminating directly onto the optical sensor
Data Source
AI summary
An optical sensor package is disclosed. The package comprises: a package substrate having a front surface and a back surface; an optical sensor mounted on the package substrate, wherein the optical sensor is encapsulated by a first light-pervious encapsulant mold; a light source mounted on the front surface of the package substrate, wherein the light source is encapsulated by a second light-pervious encapsulant mold; a central interposer mounted on the front surface of the package substrate via a support wall and between the optical sensor and the light source, wherein the central interposer and the support wall are light-impervious to prevent the light source from illuminating directly onto the optical sensor; and at least one electronic component mounted on the central interposer, wherein the at least one electronic component is electrically coupled to the optical sensor via a first interconnect that passes through the first light-pervious encapsulant mold.