Optical Sensor Shielding Film for Crosstalk Reduction
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Solution Overview
Problem
As electronic devices become more compact, adjacent electronic parts can interfere with each other due to electromagnetic waves and crosstalk occurs between light emitting and receiving units in optical sensors, which affects signal accuracy and requires additional shielding structures that occupy space and increase costs.
Innovation Solution
A shielding structure with a diffuse reflection layer on a conformal shield reduces crosstalk by minimizing light reflection in air gaps between optical sensors, using a thin film that also shields against electromagnetic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a shield structure is added to reduce crosstalk between optical sensors, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The shielding layer is integrated within the existing sensor module structure, nested between the optical sensor and the substrate. This internal integration allows the shielding function to be added without significantly increasing external device dimensions or overall structural complexity, while effectively reducing crosstalk between adjacent optical sensors
Solution Approach 2:
A shielding layer made of light-blocking material is introduced as an intermediary element between adjacent optical sensors. This intermediate structure physically blocks stray light paths between sensors, thereby reducing crosstalk and improving measurement precision without requiring fundamental changes to the sensor design
2Ease of operation
If the sensor module size is reduced for compact device design, then ease of operation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The shielding layer is formed by controlling the deposition thickness parameter during the coating process. By precisely controlling the thickness parameter of the light-blocking material layer, the shielding effect is optimized while maintaining compatibility with compact sensor module dimensions, thereby reducing crosstalk without requiring excessive manufacturing precision
3Measurement precision
If a shielding layer is formed on the substrate to reduce crosstalk, then measurement precision is improved, but manufacturing complexity increases
Solution Approach 1:
The shielding layer is formed using a coating process that utilizes the substrate's own surface as the base layer. The light-blocking material is deposited directly onto the substrate surface, allowing the substrate to serve dual purposes as both structural support and shielding foundation, thereby simplifying the manufacturing process while improving measurement precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves signal-to-noise ratio and sensing accuracy while maintaining device compactness and reducing costs by eliminating the need for separate shielding members.
Implementation Method 1
a shielding layer formed on the substrate, wherein the shielding layer comprises a light-blocking material
Data Source
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AI summary
An electronic device according to an embodiment of the disclosure includes an upper structure that forms at least a portion of an exterior of the electronic device, a sensor module including a light emitting unit and a light receiving unit spaced apart from each other on a surface thereof that faces in a first direction and faces the upper structure, and a shielding structure that has a thin film form and surrounds at least a portion of the surface of the sensor module that faces in the first direction, the first direction being a direction in which the light emitting unit emits light. The upper structure is spaced apart from a surface of the shielding structure that faces in the first direction. The shielding structure includes a shielding film layer, a lusterless layer, and a diffuse reflection layer stacked on the sensor module in the first direction. The diffuse reflection layer is formed of a mixture of a plurality of silica particles and a binder and includes, on a surface of the diffuse reflection layer, a plurality of raised parts having a mountain shape, the width of which is decreased in the first direction.