Optical Sensor Sleeve for Light Guidance and Interference Isolation

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Solution Overview

Problem

Existing electronic devices with optical sensors face challenges in effectively guiding and isolating light to prevent interference between optical components, leading to inefficient light utilization and potential cross-talk between sensors and emitters.

Innovation Solution

The electronic device incorporates a sleeve with an optical element and glue beads to create a controlled light path to the sensor, while using a cap with partitions to isolate the light emitter from the sensor, ensuring that light reaches the sensor only through the sleeve and preventing direct illumination from the emitter.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If a sleeve with traversing passage is mounted on the chip to guide light to the optical component, then light guidance efficiency is improved, but light interference and cross-talk between optical components may occur

Engineering Contradiction:
Improvelight guidance efficiencyVSAvoidlight interference
Core Design Contradiction:
Use of energy by moving objectVSObject-affected harmful factors

Solution Approach 1:

The device is segmented into distinct functional zones using the sleeve structure with its traversing passage. The sleeve creates separate light paths for different optical components, allowing light to be guided efficiently to the intended optical component while preventing cross-talk and interference between adjacent components on the chip.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sleeve provides localized light guidance properties through its traversing passage, creating a controlled optical environment at specific locations on the chip. This local optimization ensures that light reaches the intended optical component with high efficiency while maintaining isolation from other optical components, thus preventing interference.

Inventive Principle:
Principle #3Local quality

2Area of stationary object

If optical components are placed close together on the chip to reduce device size, then device compactness is improved, but light isolation between components becomes difficult

Engineering Contradiction:
Improvedevice areaVSAvoidlight cross-talk
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The sleeve structure segments the optical path into distinct traversing passages that can accommodate multiple optical components in close proximity. Each passage acts as an independent light guide, enabling compact arrangement of components while maintaining optical isolation through the segmented light paths within the sleeve.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple optical components are nested within the same chip area, with the sleeve providing a containing structure that houses multiple traversing passages. This nesting arrangement allows compact integration of components while the sleeve's internal structure maintains light isolation between the nested components.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures efficient light guidance to the sensor, reduces light interference, and allows for precise control of light paths, enhancing the performance of optical sensors and preventing unwanted light exposure.

Implementation Method 1

The traversing passage of the sleeve can be provided with at least an optical element allowing light to pass through

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS11127874B2Electronic device comprising a chip provided with an optical sensor
Publication Date: 2021.09.21 STMICROELECTRONICS (RES & DEV) LTD
  • US11127874B2 patent drawing
  • US11127874B2 patent drawing
  • US11127874B2 patent drawing

AI summary

An electronic device, comprising: a support plate having a rear face and a front face; an electronic integrated circuit chip having a rear face mounted on the front face of the support plate and including an optical component in a front face; and a sleeve forming a traversing passage and having a rear edge and a front edge at the opposite ends of the traversing passage, the rear edge being mounted on the front face of the chip, in such a position that the optical component of the chip is facing the traversing passage of the sleeve.