Optical Signal Transmission in Display Panels
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Solution Overview
Problem
The existing manufacturing process of display panels is complex and prone to defects due to the bonding of circuit boards with flexible printed circuits (FPCs) using anisotropic conductive films (ACFs), which complicates signal transmission and reduces the screen-to-body ratio of display devices.
Innovation Solution
The integration of a light emitter and a light receiver on the display panel allows for optical signal transmission between the circuit board and the driving circuit, eliminating the need for FPC bonding and simplifying the manufacturing process while improving the screen-to-body ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If FPC bonding is used to connect circuit board to array substrate, then signal transmission is achieved, but manufacturing complexity increases and screen-to-body ratio decreases
Solution Approach 1:
The patent extracts and removes the FPC bonding process from the display panel manufacturing system. By eliminating the ACF bonding step and the FPC intermediate connector, the patent directly connects the circuit board to the array substrate, thereby reducing manufacturing complexity while maintaining signal transmission functionality through integrated wiring structures
Solution Approach 2:
The patent merges the FPC bonding function with the array substrate structure by integrating signal transmission pathways directly into the substrate. The wiring structures are combined with the substrate layers, eliminating the need for separate FPC components and bonding processes, thus simplifying the overall manufacturing system
2Ease of manufacture
If bonding region is reserved on array substrate, then FPC connection is enabled, but displaying area ratio decreases
Solution Approach 1:
The patent extracts the bonding region requirement from the array substrate design. By removing the need for dedicated bonding areas, the entire substrate surface can be utilized for display purposes, thereby maximizing the displaying area ratio while maintaining connection capabilities through alternative integrated structures
Solution Approach 2:
The patent transitions the connection approach from a planar bonding region requirement to a three-dimensional integrated wiring structure. Signal transmission is achieved through vertical and lateral pathways within the substrate layers, eliminating the need for surface bonding areas and enabling full utilization of the substrate area for display
3Manufacturing precision
If ACF bonding process is used, then electrical connection is achieved, but process defects increase
Solution Approach 1:
The patent extracts and eliminates the ACF bonding process from the manufacturing system. By removing the anisotropic conductive film and its associated bonding equipment and processes, the patent reduces device complexity while achieving electrical connections through direct integrated wiring structures within the array substrate
Solution Approach 2:
The patent replaces the mechanical ACF bonding system with an integrated electrical connection system built into the substrate structure. Instead of using external bonding materials and processes, the electrical connections are formed through conductive pathways embedded within the substrate layers during manufacturing, eliminating the need for separate bonding operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing complexity, enhances product yield, and increases the screen-to-body ratio by eliminating the need for bonding spaces on the array substrate, allowing for more efficient signal transmission and improved display performance.
Implementation Method 1
a light emitter (132) is disposed on a side of the circuit board (131) close to the array substrate (111)... the light emitter (132) includes a light emitting surface (133)... configured to convert electrical signals to optical signals
Implementation Method 2
the array substrate (111) is transparent to allow the light emitted from the light emitter (132) to pass through
Implementation Method 3
a light receiver (113)... configured to receive the light emitted from the light emitter (132) and convert the received light back into electrical signals
Data Source
Figure 1~2
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Figure 5~7
AI summary
A display panel, a display device and a signal transmission device are provided. The display panel includes: an array substrate (111); an opposed substrate (121) arranged opposite to the array substrate (111); a circuit board (131), disposed on a side of the array substrate (111) away from the opposed substrate (121); a driving circuit (112), disposed on a side of the array substrate (111) close to the opposed substrate (121); a light emitter (132), disposed on a side of the circuit board (131) close to the array substrate (111) and electrically connected with the circuit board (131), in which the light emitter (132) includes a light emitting surface (133) which faces the array substrate (111); and a light receiver (113), disposed on a side of the array substrate (111) close to the opposed substrate (121) and electrically connected with the driving circuit (112), in which the light receiver (113) includes a light receiving surface (114) which faces the light emitter (132). As to the display panel, the transmission of the signal from the circuit board to the driving circuit can be realized without bonding process of the circuit board, the process difficulty in manufacturing the display panel can be reduced, and the yield of the display panel can be improved.