Optical Solid State Prepolymer for High-Power LED Packaging
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Solution Overview
Problem
Conventional thermosetting epoxy molding compounds are opaque and lack the necessary thermal and photo stability for high-power LED applications, limiting their use in semiconductor IC packaging and preventing their application in optical components like LED white reflective materials.
Innovation Solution
A molding composition comprising an optical solid state prepolymer formed by reacting epoxy resin with oligomeric silsesquioxane, combined with non-aromatic anhydride and inorganic fillers, which enhances thermal and photo stability while maintaining processability and transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermosetting epoxy molding compounds are used, then packaging and protection of semiconductor IC is achieved, but transparency and optical performance are lost
Solution Approach 1:
The patent employs composite materials by combining transparent epoxy resin with specific inorganic fillers (such as transparent alumina or silica) and functional additives. This composite approach maintains the protective packaging function while introducing optical transparency, directly resolving the contradiction between reliability and transparency.
Solution Approach 2:
The invention changes the chemical and physical parameters of the epoxy molding compound by selecting specific resin formulations with appropriate molecular structures and crosslinking densities. These parameter changes enable the material to simultaneously achieve mechanical strength for packaging and optical clarity for LED applications.
2Ease of manufacture
If conventional thermoplastic materials like PPA are used, then reflective cup functionality is achieved, but photo thermal resistance and yellowing resistance are insufficient
Solution Approach 1:
The patent changes the material parameters by transitioning from thermoplastic PPA to thermosetting transparent epoxy resin systems with enhanced thermal stability. The specific resin formulation and curing agent selection provide superior photo thermal resistance and yellowing resistance while maintaining manufacturability through transfer molding processes.
Solution Approach 2:
The invention creates composite material systems combining transparent epoxy resin with heat-resistant inorganic fillers and UV stabilizers. This composite structure provides both the functional properties needed for reflective cups and the enhanced photo thermal resistance required for high-power LED applications.
3Ease of manufacture
If conventional EMC materials are used, then semiconductor IC packaging is achieved, but thermal and photo stability for high-power LED is insufficient
Solution Approach 1:
The patent changes key material parameters including glass transition temperature, thermal conductivity, and chemical composition by selecting specialized transparent epoxy resins with aromatic or aliphatic structures. These parameter changes enable the material to withstand high-power LED operating conditions while maintaining packaging manufacturing capabilities.
Solution Approach 2:
The invention develops composite EMC materials incorporating transparent epoxy resin matrices with thermally conductive inorganic fillers (such as aluminum oxide or boron nitride) and photo-stabilizing additives. This composite structure simultaneously achieves ease of manufacture for packaging and enhanced thermal and photo stability for high-power LED applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thermosetting material with improved thermal and photo stability, mechanical strength, and transparency, suitable for high-power LED applications, overcoming the limitations of conventional materials in semiconductor IC packaging and optical components.
Implementation Method 1
a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquoxane
Data Source
AI summary
An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.