Optical Sub-Assembly Housing With PCM Heat Spreader
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Solution Overview
Problem
Optical sub-assemblies face challenges in thermal management due to uneven heat distribution and temperature gradients, which can lead to reduced performance, reliability, and premature failure of components, as external heat management systems are limited by space and efficiency.
Innovation Solution
An integrated heat spreader within the optical sub-assembly housing, utilizing phase change materials to distribute heat evenly across the assembly, is thermally coupled to heat-generating components, minimizing temperature gradients and equalizing heat loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external heat management systems are used, then heat dissipation can be achieved, but space availability is limited and thermal management efficiency is insufficient
Solution Approach 1:
The patent merges the heat management function with the housing structure by integrating the heat spreader directly into the housing base. This combination eliminates the need for separate external heat management components, achieving efficient thermal management while conserving internal space for other optical components.
Solution Approach 2:
The housing base serves multiple functions: it provides structural support for the optical components and simultaneously acts as a heat spreader for thermal management. This multi-functionality reduces the overall component count and optimizes space utilization within the housing.
2Productivity
If heat-generating components are integrated within the housing, then functional density is improved, but temperature gradients and heat distribution uniformity deteriorate
Solution Approach 1:
The patent applies local quality by positioning the heat spreader specifically in regions where heat-generating components are located. The heat spreader is thermally coupled to these components at critical heat source locations, providing targeted thermal management where it is most needed while maintaining functional density.
Solution Approach 2:
The heat spreader utilizes phase change materials that undergo phase transitions to absorb and distribute heat efficiently. This phase transition mechanism enables the heat spreader to equalize temperature gradients across the housing, maintaining uniform temperature distribution even with high functional density.
3Volume of moving object
If component density is increased, then device compactness is improved, but thermal management capability deteriorates due to limited space for heat dissipation
Solution Approach 1:
The patent combines the housing structure with the heat management system by integrating the heat spreader into the housing base. This merger enables effective thermal management in a compact design, as the heat spreader utilizes the existing housing volume rather than requiring additional external space.
Solution Approach 2:
The housing structure serves its own thermal management needs through the integrated heat spreader, eliminating the requirement for separate external cooling systems. This self-service approach maintains reliability in compact configurations by using the housing's own structure for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated heat spreader effectively reduces temperature differences and prevents thermal runaway, improving thermal management and component reliability by redistributing heat through phase transitions, maintaining temperatures within a narrow range across the assembly.
Implementation Method 1
the heat spreader contains a phase change material that is configured to undergo phase transitions between a first phase state and a second phase state, and wherein the heat spreader is configured to utilize the phase transitions to spread heat throughout the heat spreader
Implementation Method 2
the heat spreader is thermally coupled to the at least one component to receive heat from the at least one component
Data Source
AI summary
An optical sub-assembly includes a housing; at least one component integrated within the housing, wherein the at least one component is configured to generate heat during operation; and a heat spreader integrated as part of the housing or integrated within the housing. The heat spreader is thermally coupled to the at least one component to receive heat from the at least one component. The heat spreader contains a phase change material that is configured to undergo phase transitions between a first phase state and a second phase state. The heat spreader is configured to utilize the phase transitions to spread heat throughout the heat spreader. The heat spreader is configured to equalize a heat load or minimize a temperature gradient of the optical sub-assembly.