Optical Transceiver Heat Dissipation Structure With External Fins

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Solution Overview

Problem

Conventional optical transceivers face challenges in effectively dissipating heat due to their closed nature and limited space, leading to inefficient heat dispersion even with added cooling fins.

Innovation Solution

A heat dissipation structure for optical transceivers featuring a housing with exposed and hidden sections, a frame, a uniform heat component, outer fins, and an elastic clamping component that ensures close contact with a partition plate to facilitate airflow, along with heat conductive blocks and plates for enhanced heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling fins are added to the optical transceiver, then heat dissipation capability is improved, but heat energy can only disperse within a limited space of the machine and may not be effectively dissipated

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddispersion space

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent extends the heat dissipation structure from the traditional confined internal space to the external environment by adding an exposed section with cooling fins that protrude outward. This dimensional extension allows heat to dissipate into the surrounding air space beyond the machine's internal volume, effectively resolving the limitation of confined dispersion space while maintaining improved heat dissipation capability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the optical transceiver is embedded in a machine or device, then integration is improved, but heat dissipation becomes quite challenging due to closed nature

Engineering Contradiction:

Improveintegration capabilityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent divides the housing into two distinct sections: a hidden section for integration within the machine and an exposed section for heat dissipation. This segmentation allows the transceiver to maintain its embedded integration capability while providing a dedicated external pathway for effective heat dissipation, thus resolving the contradiction between integration and heat dissipation efficiency.

Inventive Principle:

Principle #1Segmentation

3Strength

If an elastic clamping component is used to clamp outer fins, then thermal contact is improved, but device complexity increases

Engineering Contradiction:

Improvethermal contactVSAvoidstructure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The elastic clamping component utilizes its own elastic deformation properties to automatically clamp and maintain thermal contact with the heat component. The component serves itself by using its inherent material characteristics to achieve the clamping function without requiring additional actuators or complex control mechanisms, thus improving thermal contact while minimizing the increase in device complexity.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure effectively reduces operating temperature and enhances safety and reliability by allowing airflows to dissipate heat beyond the hidden section, achieving rapid cooling and improved performance.

Implementation Method 1

capable of further carrying heat energy in the accommodating space by airflows in an outer space of the exposed section

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

an elastic clamping component, clamping both sides of the outer fin in a widthwise direction perpendicular to the lengthwise direction

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 3

at least one heat conductive block, which is disposed in the accommodating space and is in thermal contact with the uniform heat component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12468092B2Heat dissipation structure of optical transceiver and optical transceiver

Publication Date: 2025.11.11 WELLS FARGO BANK NA

AI summary

A heat dissipation structure of an optical transceiver includes a housing, a frame, a uniform heat component, an outer fin and an elastic clamping component. The housing has an accommodating space, extends along a lengthwise direction, and is divided into an exposed section and a hidden section in the lengthwise direction. The part of the uniform heat component corresponding to the hidden section is embedded in the accommodating space. The heat conductive block is disposed in the accommodating space and is in thermal contact with the uniform heat component. The outer fin is disposed at the exposed section and is in thermal contact with the uniform heat component. The elastic clamping component clamps both sides of the outer fin in a widthwise direction, and has a pushing member in a lengthwise direction, wherein the pushing member pushes the frame to move the outer fin inward along the lengthwise direction.