Optical Transceiver Heat Dissipation via Segmented Thermal Component
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Solution Overview
Problem
Current optical transceivers face inefficiencies in heat dissipation, relying on housing fins for heat transfer, which can limit effective cooling of electronic and optical components, impacting overall system performance and reliability.
Innovation Solution
The optical transceiver design incorporates a stacked housing with a circuit board and a heat conductive component featuring protrusions and thermal pads, enhancing heat transfer by increasing the surface area for dissipation, with the heat conductive component's main body thermally coupled to the first housing and protrusions extending to the second housing through holes, facilitating efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heat dissipation is achieved through housing fins only, then the structure is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat conductive components, each with protrusions contacting different housing fins. This divides the heat transfer path into multiple parallel channels, increasing overall heat dissipation efficiency while maintaining manufacturing simplicity through modular component design
Solution Approach 2:
The heat conductive component extends in the vertical dimension with multiple protrusions at different heights, creating three-dimensional heat transfer paths. This dimensional expansion allows simultaneous contact with multiple housing fins, significantly improving heat dissipation efficiency without complicating the horizontal structural layout
2Loss of energy
If heat conductive component projection size is increased, then heat dissipation efficiency is improved, but space utilization is reduced
Solution Approach 1:
The heat conductive component is segmented into multiple protrusions distributed across different locations and heights. This segmentation allows the thermal function to be achieved through distributed contact points rather than a large continuous structure, improving heat dissipation efficiency while minimizing space occupation
Solution Approach 2:
The heat conductive component concentrates thermal conductivity properties at specific localized protrusion points where heat transfer to housing fins is most effective. This localized quality approach achieves efficient heat dissipation without requiring extensive material presence throughout the component, optimizing space utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the temperature of heat sources within the optical transceiver, improving heat dissipation efficiency and potentially lowering manufacturing costs while maintaining performance, as demonstrated by temperature reductions from 75.92°C to 73.95°C for one heat source and 76.18°C to 74.16°C for another.
Implementation Method 1
The heat conductive component is disposed on the first surface of the circuit board and thermally coupled to the first housing
Implementation Method 2
heat dissipation of an optical communication module in the optical transceiver is usually through housing thereof which further transfers heat to the fins on the cage
Implementation Method 3
heat dissipation of an optical communication module in the optical transceiver is usually through housing thereof which further transfers heat to the fins on the cage
Data Source
AI summary
An optical transceiver includes a housing, circuit board, first heat source and heat conductive component. The housing includes first and second housing stacked on each other and together form accommodation space. The circuit board is disposed in the accommodation space. The circuit board has first and second surface. The first surface and the second surface face away from each other. The first surface faces the first housing. The second surface faces the second housing. The first heat source is disposed on the second surface of the circuit board and electrically connected to the circuit board. The heat conductive component is disposed on the first surface and thermally coupled to the first housing. Size of projection of the heat conductive component onto the second surface is larger than size of projection of the first heat source onto the second surface.