High-Density Optical Waveguide Structure for PCB Integration
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Solution Overview
Problem
Current optical waveguide structures for printed circuit boards face limitations in high-density integration due to poor bonding forces, high crosstalk, and loss, especially in fine line widths, which restricts data transmission performance and reliability.
Innovation Solution
A high-density optical waveguide structure is developed with a lower cladding layer containing trenches filled with optical waveguide material and a reflective film on the inner trench walls, integrated into a printed circuit board design, utilizing imprinting and laser ablation for precise groove formation and improved bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical waveguide structures are integrated into PCB for high-density interconnection, then wiring density and data transmission performance are improved, but manufacturing precision and bonding reliability deteriorate due to fine line width requirements
Solution Approach 1:
The patent applies preliminary action by forming trenches in the lower cladding layer before filling the core layer material. This preliminary trench formation creates predefined pathways that guide the core material placement, ensuring precise positioning and strong bonding even at fine line widths. The trenches act as molds that constrain the core layer, preventing misalignment and improving bonding reliability before the actual waveguide formation occurs.
Solution Approach 2:
The patent applies local quality by providing different structures at different locations: trenches are formed only in specific regions where waveguides are needed, and the inner walls of these trenches are treated with reflective films or adhesion promoters. This localized treatment enhances bonding and optical performance precisely where required, without affecting the entire PCB structure, thereby maintaining high manufacturing precision while achieving high wiring density.
2Ease of manufacture
If conventional optical waveguide structures are used, then manufacturing is simpler, but crosstalk and signal loss increase due to poor bonding forces
Solution Approach 1:
The patent applies composite materials by combining the lower cladding layer, core layer material, and upper cladding layer into a integrated waveguide structure. The core layer is filled into trenches formed in the lower cladding, creating a composite structure where each layer serves a specific function. This composite approach enhances bonding forces and reduces crosstalk while maintaining manufacturing feasibility through a systematic multi-step process.
Solution Approach 2:
The patent applies segmentation by dividing the optical waveguide structure into distinct segments: lower cladding layer with trenches, core layer material filled in trenches, and upper cladding layer. This segmentation allows each component to be optimized independently for its specific function while ensuring proper integration. The trench structure segments the core material from the surrounding cladding, reducing crosstalk and improving signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances wiring density, reduces crosstalk and loss, and improves bonding, enabling higher reliability and efficiency in data transmission while reducing production costs and physical size.
Implementation Method 1
the inner wall of the trench in the lower cladding layer is provided with a reflective film
Implementation Method 2
A high-density optical waveguide structure includes a lower cladding layer, a core layer and an upper cladding layer in sequence; wherein a plurality of trenches are arranged in the lower cladding layer, and the optical waveguide material is filled in the trench to form a core layer
Data Source
AI summary
The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.