Optical Waveguide Substrate with Inclined Mirror
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Solution Overview
Problem
The existing methods for producing optical waveguide mounted substrates require separate production of electrical circuit substrates and optical waveguides, leading to inefficiencies in working efficiency and production cost, as well as the need for special positioning and mounting of optical waveguides.
Innovation Solution
The method involves forming a 45-degree inclined reflecting mirror on an electrical circuit substrate during its production, allowing the optical waveguide to be integrated as an extension of the substrate, eliminating the need for separate production and simplifying the structure by forming the reflecting mirror on the substrate itself.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical circuit substrate and optical waveguide are separately produced and then combined, then each component can be optimized independently, but production cost increases and working efficiency decreases
Solution Approach 1:
The patent merges the electrical circuit substrate and optical waveguide into a single integrated structure where the optical waveguide is formed directly on the electrical circuit substrate. This eliminates the need for separate production and subsequent assembly, thereby reducing production cost and improving working efficiency while maintaining the ability to optimize each component's design independently within the integrated framework.
2Reliability
If electrical circuit substrate and optical waveguide are separately produced and then combined, then each component can be optimized independently, but production complexity increases
Solution Approach 1:
The patent combines the production processes of the electrical circuit substrate and optical waveguide into a single integrated manufacturing flow. The optical waveguide is formed using the same substrate preparation, patterning, and fabrication steps as the electrical circuit, eliminating the need for separate production lines and reducing overall production process complexity.
3Reliability
If optical waveguide is mounted separately on electrical circuit substrate, then optical transmission function is achieved, but special positioning and mounting requirements increase device complexity
Solution Approach 1:
The patent integrates the optical waveguide directly onto the electrical circuit substrate during the same fabrication process, eliminating the need for separate mounting operations. The waveguide and substrate are formed as a unified structure with inherent alignment, removing all positioning and mounting requirements and simplifying the device architecture.
4Reliability
If optical waveguide is mounted separately on electrical circuit substrate, then optical transmission function is achieved, but production cost increases
Solution Approach 1:
The patent combines the fabrication of the electrical circuit substrate and optical waveguide into a single integrated process, allowing both components to be produced simultaneously using the same materials and manufacturing steps. This eliminates the need for separate procurement, assembly, and alignment operations, thereby reducing production cost while ensuring reliable optical transmission functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and man-hours by integrating the optical waveguide with the electrical circuit substrate, enhancing working efficiency and simplifying the production process while maintaining effective optical transmission.
Implementation Method 1
performing electrolytic plating with using the conductor layer which is exposed through the openings, as an electrode, to fill the openings with a metal
Implementation Method 2
light is reflected at 90 degrees by an inclined mirror so that the light emission direction is parallel to the substrate plane
Data Source
AI summary
Openings are disposed in an insulating layer to expose a conductor layer. A lower cladding layer is formed, and a resist layer is formed on an insulating layer and the lower cladding layer. Electrolytic plating is performed with using the conductor layer which is connected to the external, as an electrode, to fill openings passing through the lower cladding layer and the resist layer with Cu. The resist layer is removed away to form projections configured by the filled Cu. The projections are processed to have an inclined face. Au layers are formed on the inclined faces of the projection. A core layer and an upper cladding layer are stacked.