Optical Window with Embedded EMI Screen for Delamination Resistance
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Solution Overview
Problem
Current methods of attaching electromagnetic interference (EMI) meshes to optically transparent materials result in partial delamination during encapsulation.
Innovation Solution
A method involving placing a conductive screen on a substrate and melting a surface portion of the substrate to embed the screen into it, using techniques like Joule heating, microwave heating, or laser heating, ensuring the screen integrates seamlessly with the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current methods of attaching EMI meshes to optically transparent materials are used, then the mesh can be attached to the surface, but partial delamination occurs during encapsulation
Solution Approach 1:
The mesh is merged with the substrate by melting the substrate material to embed the mesh within it, creating a unified structure where the mesh and substrate become integrated rather than remaining as separate attached layers, thereby preventing delamination
Solution Approach 2:
The substrate material undergoes a phase transition from solid to molten state during heating, allowing the mesh to be embedded, and then solidifies upon cooling, permanently securing the mesh within the substrate without delamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method prevents delamination and ensures a robust integration of the EMI screen within the substrate, enabling applications such as optical windows, touch screens, and windows with heating elements.
Implementation Method 1
the heating the screen includes Joule heating by passing an electrical current through the screen
Implementation Method 2
the heating the screen includes microwave heating of the screen
Implementation Method 3
the heating the screen includes laser heating of at least part of the screen
Implementation Method 4
melting a surface portion of the substrate, thereby allowing at least part of the screen to sink into and embed into the substrate
Data Source
AI summary
A method of embedding a screen in a substrate includes placing the screen on the substrate, and then melting part of the substrate, so that the screen becomes embedded in the substrate. The melting may involve heating at least part of the screen to melt part of the substrate, or directly heating the part of the substrate. The screen may be a screen of electrically-conductive material, and the heating may be Joule heating in which an electrical current is passed through the screen to heat the screen. Alternatively, the heating may involve microwave, conductive, or laser heating. The produced device of the substrate with an embedded screen may be an optical window with an embedded electromagnetic interference (EMI) screen, may be a touch screen or touch display, or may be a window with an embedded heating element, to give a few non-limiting examples.