Low-Temperature Bond Layer for Optoelectronic Assembly
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Solution Overview
Problem
Existing assembly methods for optoelectronic devices, such as SiOx/SiOx bonding and organic adhesive bonding, are harmful to temperature-sensitive components like color conversion modules and electronic layers, leading to degradation and reduced conversion efficiency.
Innovation Solution
The use of a low-temperature inorganic bonding material for the optoelectronic device, which forms a structured bond layer with cavities above the optically active structures, allowing light passage while maintaining mechanical strength and compatibility with microelectronics manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If SiOx/SiOx bonding is used to assemble the transparent glass layer, then the bonding strength is improved, but the color conversion modules and electronic layer are degraded due to high temperature annealing
Solution Approach 1:
The patent changes the temperature parameter from high temperature (200°C for SiOx/SiOx bonding) to low temperature (below 150°C) bonding process. This parameter change allows achieving sufficient bonding strength while preventing thermal degradation of temperature-sensitive components such as color conversion modules and IGZO-based TFTs in the electronic layer.
Solution Approach 2:
The patent introduces an intermediary low-temperature bonding material (such as low-temperature fired glass frit or organic-inorganic hybrid adhesive) between the glass substrate and the emitting layer. This intermediary enables bonding at temperatures below 150°C, protecting the color conversion modules and electronic layer from high temperature damage while still providing adequate bonding strength.
2Ease of manufacture
If organic adhesive bonding is used to assemble the transparent glass layer, then the assembly is simplified, but the mechanical properties and reliability are deteriorated
Solution Approach 1:
The patent employs composite bonding materials that combine organic and inorganic components (organic-inorganic hybrid adhesives) or use inorganic materials with low-temperature processing capabilities (low-temperature fired glass frit). These composite materials provide both the ease of application associated with organic adhesives and the mechanical strength and thermal stability of inorganic materials, achieving a balance between manufacturability and mechanical performance.
3Use of energy by moving object
If transparent glass substrate is used, then the light extraction efficiency is improved, but the handling and positioning become difficult due to optical detection incompatibility
Solution Approach 1:
The patent applies preliminary action by pre-assembling the emitting layer, color conversion modules, and electronic layer on a temporary substrate (such as a silicon wafer or glass substrate) before final assembly with the transparent glass cover. This preliminary assembly allows the use of standard microelectronics manufacturing techniques with opaque or semi-transparent intermediate substrates, after which the final transparent glass layer is bonded using the low-temperature method, thus maintaining both manufacturing compatibility and light extraction efficiency.
Data Source
AI summary
An optoelectronic device includes, in a stack, an emitting layer having optically active structures, configured to emit or receive radiation, a sensitive layer having at least one structure having a temperature resistance below a temperature Tmax below 200° C., a bond layer, and a transparent support layer. The bond layer is based on an inorganic low temperature bonding material. The bond layer also has cavities directly in line with the optically active structures, between the transparent support layer and the sensitive layer.