Optoelectronic Chip Convex Surface Radiation Decoupling
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Solution Overview
Problem
Existing optoelectronic chips have limited radiation decoupling efficiency, with a significant portion of electromagnetic radiation not being effectively coupled out into a specific solid angle range.
Innovation Solution
The optoelectronic chip features a semiconductor body with a radiation-emitting area and a convexly curved surface, where the radiation-emitting area is smaller than the curved surface, and a reflective layer is used to enhance radiation coupling by adjusting the emission characteristics through the curvature of the surface, which can be structured to form a mirror or lens, optimizing the direction and efficiency of radiation emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat surface is used for the semiconductor body, then the manufacturing process is simple, but the radiation decoupling efficiency is limited
Solution Approach 1:
The patent applies curvature by forming a convexly curved surface on the semiconductor body, specifically creating a spherical cap or lens-shaped structure. This curvature modifies the optical path of emitted radiation, enabling better coupling into optical fibers or waveguides by matching the numerical aperture, thereby significantly improving radiation decoupling efficiency while maintaining manufacturing feasibility through standard semiconductor processing techniques
2Quantity of substance
If the radiation-emitting area is made larger to increase total radiation output, then the total light generation increases, but the decoupling efficiency into a specific solid angle decreases
Solution Approach 1:
The patent applies local quality by creating a specific geometric configuration where only a portion of the semiconductor body surface is convexly curved, specifically forming a spherical cap or lens region directly above the radiation-emitting area. This localized curvature optimizes the decoupling of radiation into a specific solid angle (matching optical fiber numerical aperture) while maintaining appropriate emitting area size, thus simultaneously achieving both total radiation output and directional decoupling efficiency
3Loss of energy
If the convexly curved surface area is made larger to improve decoupling efficiency, then more radiation can be coupled out, but the radiation-emitting area becomes insufficient
Solution Approach 1:
The patent applies partial action by forming a convexly curved surface (spherical cap or lens) that extends beyond the immediate radiation-emitting area but is controlled to not excessively dominate the overall device structure. The curved region serves as an optical interface for enhanced coupling, while the underlying active layer maintains sufficient emitting area. This partial curvature approach achieves improved decoupling efficiency without sacrificing the radiation-emitting area, as the curvature primarily affects the upper surface geometry rather than the active emission zone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases the decoupling efficiency of electromagnetic radiation into a specific solid angle range, improving the chip's performance by ensuring a larger proportion of generated radiation is coupled out effectively.
Implementation Method 1
The surface of the semiconductor body has a convex curvature at least in a partial region of the semiconductor body. This subarea is structured, for example, in the surface of the semiconductor body. The surface of the semiconductor body that has the convex portion faces a carrier.
Implementation Method 2
a reflective layer is used to enhance radiation coupling by adjusting the emission characteristics through the curvature of the surface, which can be structured to form a mirror or lens, optimizing the direction and efficiency of radiation emission.
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
Optoelectronic chip has a semiconductor body (14) with radiation-emitting region (2), a sub-region (3) in which the surface (13) of semiconductor body is curved, and is convex to the support (10). The lateral extent (2r) of the radiation-emitting region is smaller than the lateral extent (2R) of the sub-region. An independent claim is also included for the method for producing optoelectronic chip.