Optoelectronic Chip Embedding with Exposed Contact Pads
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Solution Overview
Problem
Existing optoelectronic device production methods fail to efficiently embed semiconductor chips into mold compounds while keeping electrical contact pads exposed and ensuring effective radiation reflection and protection from moisture and mechanical stress.
Innovation Solution
A method involving embedding optoelectronic semiconductor chips into a mold compound with a recessed carrier, using wavelength-converting materials and reflective particles, and employing film-assisted transfer molding to keep contact pads exposed and forming a chip-scale package with reflective properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optoelectronic semiconductor chip is fully embedded into the mold compound, then the device provides comprehensive protection from moisture and mechanical stress, but the electrical contact pads at the bottom side become covered and inaccessible
Solution Approach 1:
The mold compound is selectively applied to cover only specific regions of the semiconductor chip while leaving the electrical contact pads exposed. This local differentiation allows the chip structure to be protected where needed while maintaining accessibility of functional elements, resolving the contradiction between comprehensive protection and operational accessibility.
2Manufacturing precision
If a recess is formed in the carrier to surround the semiconductor chip, then the chip can be properly embedded and positioned, but the manufacturing process becomes more complex
Solution Approach 1:
A recess is pre-formed in the carrier structure before the semiconductor chip is placed. This preliminary preparation of the carrier geometry provides precise positioning guidance for the chip and defines the embedding region, thereby achieving high manufacturing precision while keeping the overall process sequence simple and manageable.
3Illumination intensity
If wavelength-converting material is applied over the entire chip surface, then desired electromagnetic radiation colors can be generated, but the electrical contact pads become covered and electrical connectivity is compromised
Solution Approach 1:
The wavelength-converting material is selectively applied only to the active regions of the semiconductor chip that require color conversion, while deliberately excluding the electrical contact pads. This localized application ensures both the desired electromagnetic radiation color generation and maintained electrical connectivity, resolving the contradiction between optical functionality and electrical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the production of optoelectronic devices that can generate desired electromagnetic radiation colors, maintain electrical connectivity, and provide protection from environmental factors while forming a compact, reflective chip-scale package.
Implementation Method 1
A mold compound is arranged in the recess and above the surface of the carrier such that the optoelectronic semiconductor chip is embedded into the mold compound
Implementation Method 2
A wavelength-converting material is arranged above the surface of the carrier before arranging the optoelectronic semiconductor chip
Implementation Method 3
The carrier is removed
Implementation Method 4
The mold compound is cut. Cutting is performed in regions of elevations formed by the mold compound
Data Source
AI summary
An optoelectronic device and a method for producing an optoelectronic device are disclosed. In an embodiment a method includes arranging an optoelectronic semiconductor chip with its top side towards a surface of a carrier, forming a recess at the surface of the carrier such that the recess surrounds the optoelectronic semiconductor chip, arranging a mold compound in the recess and above the surface of the carrier such that the optoelectronic semiconductor chip is embedded into the mold compound, wherein a bottom side of the optoelectronic semiconductor chip remains at least partially not covered by the mold compound, removing the carrier and arranging a wavelength-converting material above the surface of the carrier before arranging the optoelectronic semiconductor chip, wherein the wavelength-converting material is perforated while forming the recess.