Optoelectronic Component Production Using Intermediate and Cavity Films
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Solution Overview
Problem
Existing methods for producing optoelectronic components in chip scale package design are lengthy and reduce yield due to multiple intermediate carrier steps, requiring flipping and attachment processes that complicate the fabrication process.
Innovation Solution
A method involving the use of a flexible intermediate film and a cavity film with openings, where optoelectronic semiconductor chips are temporarily attached to the intermediate film, then encased within the cavity film using a casting material, allowing for efficient production by eliminating the need for multiple intermediate carrier steps and flipping processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple intermediate carrier steps are used to attach and transfer optoelectronic semiconductor chips, then the chips can be positioned and fixed during production, but the production process becomes lengthy and yield is reduced
Solution Approach 1:
The patent extracts and eliminates the unnecessary intermediate carrier steps from the production process. By using a single intermediate film that directly receives chips from the wafer and transfers them to the final substrate, the method removes multiple attachment and detachment operations, thereby shortening the production process while maintaining chip positioning accuracy
Solution Approach 2:
The intermediate film is prepared in advance with adhesive properties and geometric features that enable direct chip attachment. The film is pre-configured with alignment marks and adhesive regions that allow chips to be positioned and fixed in a single step, eliminating the need for multiple intermediate carrier operations during the production process
2Reliability
If multiple intermediate carrier steps are used for chip attachment and transfer, then chips can be temporarily fixed during fabrication, but the process complexity increases
Solution Approach 1:
The patent merges the functions of multiple intermediate carriers into a single intermediate film. This film combines adhesive properties, mechanical support, alignment features, and transfer capabilities that were previously distributed across multiple separate carriers, thereby reducing process complexity while maintaining chip fixation stability
Solution Approach 2:
The intermediate film is designed as a multi-functional element that performs multiple roles: it serves as an adhesive carrier for chip attachment, provides mechanical support during handling, enables alignment through geometric features, and facilitates transfer to the final substrate. This universal design eliminates the need for multiple specialized intermediate carriers
3Ease of operation
If flipping and attachment processes are used to transfer chips between carriers, then chips can be repositioned and secured, but the fabrication process is complicated
Solution Approach 1:
Instead of the conventional approach of attaching chips to a carrier, flipping the chip, and then transferring it to the substrate, the patent inverts the process by maintaining the chip in its original orientation throughout. The intermediate film and substrate are designed to receive and secure the chip without requiring flipping, thereby simplifying the fabrication process while maintaining transfer capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces production time and increases yield by simplifying the process flow, enabling the rapid and efficient fabrication of optoelectronic components with a chip scale package design.
Implementation Method 1
A top side of the intermediate film, extending along the main extension direction, may be adhesive
Implementation Method 2
a casting material is filled in each of the openings such that the semiconductor chips are casted with the casting material
Data Source
AI summary
An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes attaching a plurality of optoelectronic semiconductor chips on predetermined locations of an intermediate film, providing a cavity film with a plurality of separated openings, attaching the cavity film to the intermediate film such that each optoelectronic semiconductor chip is associated with a respective opening, wherein the cavity film is thicker than the optoelectronic semiconductor chips such that the cavity film exceeds the optoelectronic semiconductor chips in a direction away from the intermediate film, filling a casting material in each of the openings such that the optoelectronic semiconductor chips are casted with the casting material and removing the intermediate film.