Optoelectronic Component Contact Frame Recess Segmentation
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Solution Overview
Problem
Existing optoelectronic components with wireless electrical connections face complexity due to the need for insulating layers to prevent short-circuits, making the connection process intricate.
Innovation Solution
The design incorporates a contact frame with recesses that separate electrical connection zones, allowing the optoelectronic semiconductor chip to project into these recesses, minimizing radiation losses and enabling a simple wireless electrical connection using a contact element that connects the chip to the contact frame, while the contact frame and carrier are made from conductive materials for efficient electrical supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive transparent layer is applied to a support film for wireless electrical connection, then electrical connection is achieved, but the structure becomes complex requiring insulating layers to prevent short-circuits
Solution Approach 1:
The contact frame is segmented into multiple electrically insulated connection zones (first and second zones) separated by a recess. This segmentation allows each zone to be independently connected to the semiconductor chip without requiring additional insulating layers between them, as the recess itself provides the electrical insulation. The segmentation principle resolves the contradiction by achieving reliable electrical connections while reducing structural complexity.
Solution Approach 2:
The recess in the contact frame acts as an intermediary element that provides electrical insulation between different connection zones. Instead of adding complex insulating layers between conductive elements, the recess (filled with insulating material or air) serves as a simple mediator that prevents short-circuits while maintaining a clean and simple overall structure.
2Reliability
If insulating layers are added between transparent layer and semiconductor chip to avoid short-circuits, then short-circuit prevention is achieved, but the connection process becomes intricate
Solution Approach 1:
The insulating function is merged into the contact frame structure itself through the recess, rather than being a separate layer. The recess is an integral part of the contact frame that combines mechanical support, electrical insulation, and structural definition into a single element. This merging simplifies the manufacturing process by reducing the number of separate components and assembly steps required.
Solution Approach 2:
The insulating material is extracted from being a separate layer between the transparent layer and chip, and is instead placed within the recess of the contact frame. This extraction simplifies the overall structure by removing the need for multiple layered insulating components and their associated alignment and bonding processes.
3Use of energy by moving object
If contact frame and carrier are made from conductive materials, then electrical supply efficiency is improved, but radiation losses may increase
Solution Approach 1:
The contact frame exhibits local quality differentiation: it is conductive where electrical connection is needed (contact elements and connection zones) and insulating where radiation passage is required (the recess area). This local differentiation allows the structure to simultaneously achieve efficient electrical supply through conductive paths while minimizing radiation losses by providing a clear, unobstructed path for light through the recess.
Data Source
AI summary
An optoelectronic component has an optoelectronic semiconductor chip, a contact frame, a contact carrier, a first electrical connection zone and a second electrical connection zone electrically insulated from the first electrical connection zone, which each have a part of the contact frame and a part of the contact carrier, wherein the contact frame has a recess which separates the first electrical connection zone at least in places from the second electrical connection zone and into which the optoelectronic semiconductor chip projects, and wherein the contact frame has a contact element which connects the contact frame electrically with the optoelectronic semiconductor chip.