Optoelectronic Component Cooling Element Design

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Optoelectronic components face challenges in effective heat dissipation due to the increasing demand for smaller dimensions, leading to reduced efficiency and maximum allowable currents, and conventional cooling methods are either inefficient or costly.

Innovation Solution

An optoelectronic component design featuring electrically insulating cooling elements with high thermal conductivity (>30 W/(m·K)) placed between contact elements on the contact side, which are spaced apart to prevent solder overflow and allow for closer contact element placement, enhancing heat dissipation and preventing short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If contact elements are placed closer together to reduce component size, then the component dimensions are reduced, but solder overflow occurs causing short circuits

Engineering Contradiction:

Improvecomponent dimensionsVSAvoidsolder connection reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

An electrically insulating cooling element is introduced as an intermediary between the contact elements. This cooling element serves dual purposes: it provides thermal management for the semiconductor component and acts as a physical barrier that prevents solder overflow from bridging adjacent contact elements, thereby enabling closer spacing while maintaining solder connection reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cooling element performs multiple functions simultaneously: it cools the semiconductor component by conducting heat away, provides electrical insulation between contact elements to prevent short circuits, and serves as a mechanical barrier against solder overflow. This multi-functionality allows contact elements to be placed closer together without compromising reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If conventional cooling methods are used, then cooling functionality is provided, but heat dissipation efficiency is insufficient or production costs increase

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidproduction cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The cooling element combines thermal management and electrical insulation functions in a single component. By integrating these functions, the patent eliminates the need for separate cooling structures and insulation layers, thereby improving heat dissipation efficiency while reducing production complexity and costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cooling element is made from composite materials that simultaneously provide high thermal conductivity for effective heat dissipation and high electrical insulation properties to prevent short circuits. This material selection enables efficient thermal management without requiring additional insulating layers, simplifying manufacturing and reducing costs.

Inventive Principle:

Principle #40Composite materials

3Reliability

If contact elements are spaced apart to prevent short circuits, then solder connection reliability is maintained, but the area for heat dissipation is reduced

Engineering Contradiction:

Improveelectrical contacting reliabilityVSAvoidheat dissipation area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The cooling element acts as an intermediary structure between contact elements, providing electrical insulation and preventing solder overflow without requiring large spacing between contact elements. This enables the contact elements to be positioned closer together, maximizing the heat dissipation area on the component surface while maintaining electrical insulation and preventing short circuits.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively increases the area for heat dissipation, prevents solder overflow, and allows for smaller contact element distances, improving the efficiency and maximum allowable currents of optoelectronic components while maintaining reliable electrical contacting.

Implementation Method 1

the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11588088B2Optoelectronic component that dissipates heat

Publication Date: 2023.02.21 OSRAM OLED

AI summary

An optoelectronic component includes a radiation side, a contact side opposite the radiation side having at least two electrically conductive contact elements, and a semiconductor layer sequence having an active layer that emits or absorbs the electromagnetic radiation, wherein the at least two electrically conductive contact elements have different polarities, are spaced apart from each other and are completely or partially exposed at the contact side in an unmounted state of the optoelectronic component, a region of the contact side is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in a plan view of the contact side, the cooling element partially covers one or both of the at least two electrically conductive contact elements.