Optoelectronic Heat Spreader for Thermal Management
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Solution Overview
Problem
Conventional optoelectronic devices face challenges in thermal management and assembly, particularly in achieving a low resistance thermal path between the optoelectronic die and heat sink, and ensuring robust electrical isolation, which affects the efficiency and reliability of high power LED lighting systems and photovoltaic receivers.
Innovation Solution
The integration of heat spreader units above back-contact metallization regions in optoelectronic devices, combined with a flexible substrate manufactured via continuous roll processing, provides a uniform and flat surface for improved thermal coupling and electrical isolation, reducing thermal resistance and enabling high volume continuous manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional assembly methods are used for optoelectronic devices, then manufacturing simplicity is maintained, but thermal management performance deteriorates due to high thermal resistance between the optoelectronic die and heat sink
Solution Approach 1:
The patent combines multiple functions into the substrate: it serves as both the mechanical support and the heat spreader. The substrate is made of thermally conductive material and includes a heat spreader layer with high thermal conductivity to conduct heat away from the optoelectronic die, eliminating the need for separate thermal management components and simplifying assembly while improving thermal performance
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: mechanical support, electrical isolation, and thermal management. The heat spreader layer integrated into the substrate provides thermal conduction while the substrate itself provides electrical isolation between the optoelectronic die and the heat sink, reducing the need for additional components
2Reliability
If electrical isolation layers are added between the optoelectronic die and heat sink, then electrical isolation is improved, but thermal resistance increases
Solution Approach 1:
The patent introduces a heat spreader layer as an intermediary between the optoelectronic die and the heat sink. This layer is made of thermally conductive material that provides both thermal conduction and electrical isolation. The heat spreader layer mediates between the need for electrical isolation and thermal conduction by providing a path for heat flow while maintaining electrical isolation through its material properties and design
3Productivity
If discrete component assembly is used, then manufacturing flexibility is maintained, but manufacturing efficiency deteriorates due to inability to perform high volume continuous manufacturing
Solution Approach 1:
The patent performs preliminary actions by pre-assembling the optoelectronic die, interconnects, and heat spreader layer onto the substrate before final integration. The substrate is prepared with integrated heat spreader structures and electrical isolation layers in advance, allowing for continuous processing and high-volume manufacturing while maintaining design flexibility
Solution Approach 2:
The patent enables continuous manufacturing by designing the substrate and heat spreader layer as integrated components that can be manufactured and assembled in a continuous process. The substrate serves as a continuous platform for mounting multiple optoelectronic devices, allowing for high-volume production without discrete assembly steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal performance, allowing optoelectronic devices to operate at lower temperatures, increase light-to-electrical conversion efficiency, and reduce component degradation and failure, while facilitating high volume continuous manufacturing processes.
Implementation Method 1
one or more heat spreader units disposed above the plurality of back-contact metallization regions. A heat sink is disposed above the one or more heat spreader units
Data Source
AI summary
A solar module includes a solar cell, a heat spreader layer disposed above the solar cell, and a cell interconnect disposed above the solar cell. From a top-down perspective, the heat spreader layer at least partially surrounds an exposed portion of the cell interconnect.