Optoelectronic Component Lead Frame Embedding for Reflectivity
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Solution Overview
Problem
Existing optoelectronic components with lead frames face challenges in achieving high optical reflectivity and mechanical stability due to environmental aging and potential separation risks between the lead frame and molded body.
Innovation Solution
A method involving a lead frame with a contact region and chip reception region, where the lead frame is embedded in a molded body, with the contact region covered to protect against aging and enhance bonding, and an electrically conductive element is arranged to ensure reliable connections and optical reflectivity without the need for expensive coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal coating is applied to the lead frame to increase optical reflectivity and aging stability, then optical reflectivity and aging resistance are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the coating from the lead frame entirely. Instead of coating the lead frame, the invention uses an uncoated lead frame embedded in a molded body where the molded body's upper side provides the optical reflectivity function. This eliminates the coating process while maintaining aging stability and optical reflectivity.
Solution Approach 2:
The molded body acts as an intermediary between the lead frame and the optical environment. Instead of coating the lead frame directly, the molded body is positioned between the light source and the lead frame, providing the necessary optical reflectivity and protecting the lead frame from environmental aging.
2Reliability
If the lead frame is fully embedded in the molded body for protection, then mechanical stability and protection against aging are improved, but accessibility of the contact region deteriorates
Solution Approach 1:
The patent applies local quality by differentiating the embedding depth of different regions of the lead frame. The contact region remains accessible and is not covered by the molded body, while other portions of the lead frame are embedded for protection. This allows the contact region to maintain electrical accessibility while other areas gain environmental protection.
3Illumination intensity
If expensive metal coatings are applied to achieve high optical reflectivity, then optical reflectivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent removes the expensive metal coating from the lead frame entirely. The optical reflectivity function is transferred to the molded body, which is a cost-effective material. This extraction of the coating function eliminates material costs and coating process expenses while maintaining the required optical reflectivity.
4Ease of operation
If the contact region is left exposed for accessibility, then ease of connection is improved, but susceptibility to environmental aging increases
Solution Approach 1:
The patent applies local quality by selectively exposing only the contact region while embedding the rest of the lead frame. The contact region remains accessible for electrical connections, while the embedded portions are protected from environmental aging by the molded body. This localized approach balances accessibility with protection.
Data Source
AI summary
A method of producing an optoelectronic component includes providing a lead frame having an upper side including a contact region and a chip reception region raised relative to the contact region; arranging an electrically conductive element on the contact region; embedding the lead frame in a molded body, wherein the contact region is covered by the molded body, and the chip reception region and the electrically conductive element remain accessible on an upper side of the molded body; arranging an optoelectronic semiconductor chip on the chip reception region; and connecting the optoelectronic semiconductor chip and the electrically conductive element by a bonding wire.