Optoelectronic Component Mirror Layer Radiant Power Coupling
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Solution Overview
Problem
Existing optoelectronic components face challenges in achieving high specific emissivity while being produced in a simplified and cost-effective manner, as they often suffer from reduced radiant power due to absorption by contacts and lack of efficient radiation coupling.
Innovation Solution
The design features a semiconductor body with an active region and two electrical contacts on a common connection side, where the mirrored side is reflective, directing radiation back into the component and increasing radiant power coupling via a mirror layer with high reflectivity, and a method for producing such components with a mirror layer applied to a composite element before separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a mirrored side surface is provided to increase specific emissivity, then radiant power coupling is improved, but device complexity increases due to additional mirror layer deposition processes
Solution Approach 1:
The patent combines the mirror layer deposition with the existing semiconductor manufacturing process by applying the mirror layer to the composite element before separation. This integrates the optical enhancement function into the standard production flow, reducing overall process complexity while achieving high radiant power coupling through the mirrored side surface
2Ease of manufacture
If contacts are arranged on a common connection side, then ease of manufacture is improved, but radiant power is reduced due to contact absorption
Solution Approach 1:
The patent converts the harmful effect of contact absorption by positioning both contacts on the common connection side opposite to the mirrored side. The mirror then reflects any radiation that would otherwise be lost back into the component, turning the potential loss into a benefit by increasing the path length and coupling efficiency of the radiant power
3Productivity
If a mirror layer is deposited on the composite element before separation, then productivity is improved through batch processing, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs the mirror layer deposition on the composite element before separation into individual components. This preliminary action allows batch processing of multiple components simultaneously, improving productivity. The uniform application of the mirror layer across the entire composite surface ensures consistent optical properties are achieved across all separated components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances specific emission by reducing radiation loss on the mirrored side and allows for cost-effective production of optoelectronic components with increased radiant power coupling, avoiding absorption by contacts and simplifying the production process.
Implementation Method 1
Radiation striking the mirrored side of the component is reflected back into the component due to the mirroring
Implementation Method 2
The mirror layer is preferably deposited on the device, e.g. B. by means of a PVD or CVD method (PVD: Physical Vapor Deposition; CVD: Chemical Vapor Deposition), such as sputtering, vapor deposition or reactive sputtering
Implementation Method 3
a semiconductor body, which has an active region suitable for generating radiation
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
The invention relates to an optoelectronic component (1) comprising a semiconductor body (2) with an active region (4) that is suitable for generating radiation and two electric contacts (7, 8) situated on the semiconductor body. The contacts are connected to the active region in an electrically conductive manner, each contact has a connection surface (70, 80) facing away from the semiconductor body, the connection surfaces are situated on a connection side of the component and one side of the component that is not the connection side is covered with a reflective surface. The invention also relates to a method for producing a plurality of components of this type.