Optoelectronic Module With Integrated Control Circuits
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Solution Overview
Problem
Existing optoelectronic modules lack integrated control and regulation electronics and heat sinks, leading to inefficient light generation and control of light-emitting structures, requiring complex grouping and sorting of LED chips for homogeneous radiation characteristics.
Innovation Solution
An optoelectronic module with a layer structure comprising a substrate layer and a second layer arrangement that includes circuits for controlling the light-emitting layer, such as brightness, color, and electrostatic discharge protection, integrated into the substrate layer for space-saving and efficient control of light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If control electronics and sensors are implemented as discrete components on the module circuit board, then the module can be assembled with individually placed light-emitting components, but the device complexity increases and space is consumed by component housings
Solution Approach 1:
The patent integrates control electronics, sensors, and light-emitting components directly into the semiconductor substrate, eliminating the need for separate discrete components and their housings. This merging approach reduces device complexity while maintaining manufacturing flexibility through integrated circuit design.
Solution Approach 2:
The semiconductor substrate serves multiple functions simultaneously: it acts as the mounting platform for light-emitting components, provides integrated control electronics, incorporates sensors for regulation, and offers heat dissipation pathways. This multi-functionality eliminates the need for separate discrete components.
2Device complexity
If control electronics are integrated into the substrate layer, then space is saved and device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
By merging control electronics, sensors, and light-emitting structures into a single integrated semiconductor substrate, the patent achieves space savings and complexity reduction. The integrated architecture inherently manages precision requirements through standardized semiconductor manufacturing processes.
3Stability of the object's composition
If LED chips are grouped and sorted to achieve homogeneous radiation characteristics, then light uniformity is improved, but manufacturing time and complexity increase
Solution Approach 1:
The patent integrates control electronics directly with each light-emitting component on the semiconductor substrate, enabling individual control and compensation of radiation characteristics without requiring time-consuming grouping and sorting processes. This approach achieves radiation homogeneity through active control rather than passive selection.
Solution Approach 2:
Integrated sensors and control electronics provide real-time feedback on the radiation characteristics of each light-emitting component, enabling dynamic adjustment and compensation to achieve homogeneous overall radiation without manual grouping and sorting.
4Ease of operation
If discrete sensor components are used for controlling light emission, then the control function can be implemented, but the module requires more space and has higher device complexity
Solution Approach 1:
The semiconductor substrate is designed to perform multiple functions: housing light-emitting components, integrating control electronics, incorporating sensors for light/temperature/color measurement, and providing heat dissipation. This eliminates the need for separate discrete sensor components and their housings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective control of light generation, eliminates the need for complex grouping of LED chips, and allows for on-site tuning of emission characteristics, compensating for manufacturing tolerances and user preferences, while integrating ESD protection and heat dissipation for improved reliability and efficiency.
Implementation Method 1
The first layer arrangement contains a light-emitting structure, in particular a light-emitting diode without substrate, a CSP light-emitting diode, an organic light-emitting diode or a high-power light-emitting diode
Implementation Method 2
The substrate layer can contain, for example, silicon or SiC or germanium or gallium nitride or aluminum nitride or aluminum oxide or silicon nitride or a combination thereof
Implementation Method 3
The second layer arrangement can contain a circuit for detecting a brightness of the surroundings of the integrated circuit
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
An optoelectronic module (1) comprises a supporting substrate layer (10) encompassing several circuits (200) that have been previously structured into or onto the supporting substrate layer (10) on the wafer level in front-end processes. Light emitting diodes (100), the emission characteristics, brightness, and color of which are controlled by the circuits (200) integrated into/onto the supporting substrate layer (10), are arranged on the supporting substrate layer (10). By interconnecting several optoelectronic modules (1, 2, 3), module arrangements are created which have an extremely high degree of packing density and excellent properties in respect of color fidelity and dimmability. The individual optoelectronic modules of such a module arrangement can be adjusted to each other or to the surroundings in an autonomous or coupled manner.