Optoelectronic Module Thermal Management via Segmented Subcarrier
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Solution Overview
Problem
Pluggable transceivers face challenges in optimizing space usage and maintaining component temperatures within acceptable ranges, particularly in switching systems where compact designs are required.
Innovation Solution
A transceiver assembly with a housing, an optical subassembly including a fiber, photonic integrated circuit, and an analog electronic integrated circuit on a thermally conductive subcarrier, allowing for separate testing and efficient thermal management through a thermally conductive subcarrier and routing board with organic insulating material and conductive traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact pluggable transceiver design is implemented, then space constraints are respected, but thermal management becomes difficult
Solution Approach 1:
The module is divided into separate transmit and receive optical subassemblies, each with its own photonic integrated circuit and associated components. This segmentation allows for optimized thermal paths for each subassembly, with heat-sinking structures specifically designed for high-power laser diodes in the transmit path, while maintaining overall compact form factor.
Solution Approach 2:
A thermally conductive subcarrier board is introduced as an intermediary between the photonic integrated circuits and the housing. This subcarrier provides dedicated thermal pathways with high thermal conductivity materials to efficiently conduct heat away from sensitive components to heat-sinking structures in the housing, resolving the thermal management challenge in the compact design.
2Volume of moving object
If integration density is increased, then space is optimized, but testing complexity increases
Solution Approach 1:
The optical module is segmented into independently testable subassemblies (transmit and receive paths). Each subassembly has defined external contact pads that allow boundary-scan testing and independent characterization before final integration, reducing overall testing complexity despite high integration density.
Solution Approach 2:
Subassemblies are pre-tested and characterized before final module assembly. The design includes test access points and contact pads that enable preliminary testing of photonic integrated circuits and optical paths independently, allowing defects to be identified and corrected before integration, thereby simplifying final module testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective thermal conductivity and compact design while allowing for separate testing and integration of the optical subassembly, improving the performance and reliability of pluggable transceivers in switching systems.
Implementation Method 1
the subcarrier being parallel to, secured to, and in thermal contact with, a first wall of the housing; the subcarrier having a thermal conductivity greater than 10 W/m/K
Data Source
AI summary
An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.