Optoelectronic Package Embedding Electronic Component in Carrier Cavity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In existing optoelectronic package structures, the vertical arrangement of the processing unit, carrier, and photonics engine results in a long electrical path due to the thickness of the carrier, leading to high-speed signal distortion and a large package size, as through vias with high aspect ratios are required for electrical connection.
Innovation Solution
The optoelectronic package structure embeds the electronic component within a carrier's cavity, reducing the thickness between the processing unit and electronic component, eliminating the need for high-aspect-ratio through vias and minimizing package size by using a carrier with distinct regions for power supply and signal paths, including a first power supply path, a second power supply path, and an electrical signal path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a relatively thick carrier is used to support the vertical arrangement of ASIC and optoelectronic device, then the mechanical strength and structural stability are improved, but the electrical path length increases causing signal distortion
Solution Approach 1:
The patent transitions from a conventional vertical stacking arrangement to a lateral or planar arrangement where the ASIC and optoelectronic device are positioned side-by-side or at reduced vertical separation on the carrier. This dimensional reconfiguration significantly shortens the electrical connection paths while preserving the carrier's mechanical support function, thereby resolving the contradiction between structural strength and signal transmission quality.
2Reliability
If through vias with high aspect ratios are used to electrically connect the ASIC and optoelectronic device through the thick carrier, then the electrical connection is achieved, but the manufacturing complexity and reliability deteriorate
Solution Approach 1:
The patent extracts or eliminates the need for high-aspect-ratio through vias by reconfiguring the electrical connection architecture. Instead of routing signals vertically through the entire thickness of the carrier, the design uses alternative connection paths such as lateral traces, reduced-height vias, or repositioned components that connect to intermediate connection layers. This extraction of the problematic through-via structure simplifies manufacturing while maintaining electrical connectivity.
3Stability of the object's composition
If the optoelectronic device and ASIC are arranged in vertical direction with thick carrier, then the package structure is stable, but the package size increases
Solution Approach 1:
The patent employs dimensional reconfiguration by arranging components in a lateral or partially planar configuration rather than strict vertical stacking. This allows the package to utilize horizontal space more efficiently, reducing the overall vertical height and thickness of the package while maintaining structural stability through optimized carrier design and component placement.
Data Source
AI summary
An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.