Optoelectronic Component With Segmented Housing And Leadframe
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Solution Overview
Problem
Existing optoelectronic components lack a cost-effective method to produce components with separate housing bodies that can be oriented in different spatial directions while maintaining mechanical and electrical connectivity, which limits their compactness and mounting options.
Innovation Solution
The use of a leadframe embedded in two separate housing bodies, where sections of the leadframe provide both mechanical and electrical connections, allowing for flexible orientation and compact design through bending and soldering contact surfaces, enabling surface mounting and efficient chip integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single housing body is used for optoelectronic components, then the structure is simple and manufacturing is easier, but the component cannot be oriented in different spatial directions and mounting flexibility is limited
Solution Approach 1:
The housing body is divided into two separate housing bodies (first housing body and second housing body) that are spatially separated and can be oriented independently. Each housing body contains specific component parts, allowing them to be mounted and oriented in different spatial directions while maintaining functional integration through the leadframe connection.
2Adaptability or versatility
If separate housing bodies are used for different component parts, then spatial orientation flexibility is improved, but mechanical connection and electrical connectivity between housing bodies becomes more complex
Solution Approach 1:
The leadframe serves multiple functions simultaneously: it provides mechanical support for the optoelectronic semiconductor chip, establishes electrical connections between different component parts, and mechanically connects the two separate housing bodies. This multi-functional integration simplifies the overall connection structure despite the presence of separate housing bodies.
3Productivity
If traditional mounting methods are used for optoelectronic components, then manufacturing is straightforward, but compactness and mounting options are limited
Solution Approach 1:
The optoelectronic component is designed with a three-dimensional configuration where the two housing bodies and their contained components are arranged in different spatial planes and orientations. This dimensional arrangement enables compact integration while maintaining accessibility for standard surface mounting techniques, allowing efficient assembly without compromising compactness.
Data Source
AI summary
An optoelectronic component includes a first housing body and a second housing body separate from the first housing body. A first section of a leadframe is embedded into the first housing body. A second section of the leadframe connected integrally the first section, is embedded into the second housing body.