Optoelectronic Semiconductor Chip Embedded in Shaped Body

The patent uses a composite molding compound consisting of a plastic matrix material combined with inorganic filler particles (such as aluminum oxide, boron nitride, or silicon dioxide). This composite structure provides both the mechanical strength needed for stability and the thermal conductivity necessary for efficient lateral radiation emission. The filler particles form a rigid network within the plastic matrix, creating a mechanically stable yet thermally efficient support structure.

The patent modifies the physical and chemical parameters of the molding compound by adjusting the filler content (50-95 wt%), selecting specific filler particle sizes and shapes, and choosing appropriate plastic matrix materials with different thermal and mechanical properties. These parameter changes enable optimization of both mechanical stability and thermal radiation performance to achieve lateral emission efficiency.

The patent combines multiple functions into the single molding compound material: structural support, thermal management, electrical insulation, and mechanical protection of the semiconductor chip. By integrating these functions into one composite material rather than using separate components, the design reduces assembly steps and manufacturing complexity while achieving high mechanical stability.

The patent creates a homogeneous distribution of filler particles throughout the plastic matrix material, ensuring uniform mechanical and thermal properties throughout the molding compound. This homogeneity simplifies manufacturing by eliminating the need for layered structures or complex multi-material assemblies, while still providing the required mechanical stability.