Optoelectronic Semiconductor Component With Embedded Protective Diode

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Solution Overview

Problem

Conventional optoelectronic semiconductor components have high production costs due to their multifunctional housings, which include electrical connections, mounting interfaces, and electrostatic discharge protection, often requiring complex wiring and separate through contacts.

Innovation Solution

An optoelectronic semiconductor component design that embeds both the semiconductor chip and a protective diode chip into a molded body, eliminating the need for separate electrical feedthroughs and rear-side wiring, with electrical contacts arranged on the surface for surface mounting and compact production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional multifunctional housings are used to provide electrical connections, mounting interfaces, and ESD protection, then the component fulfills multiple functions, but the production cost increases significantly

Engineering Contradiction:

Improvemultiplicity of functionsVSAvoidproduction cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent merges the protective chip with ESD protective diode into the same substrate as the optoelectronic semiconductor chip, forming a single integrated component structure. This consolidation eliminates the need for separate housings to provide ESD protection, electrical connections, and mounting interfaces, thereby reducing production costs while maintaining multiple functions.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing structure is designed to simultaneously serve multiple purposes: providing mechanical protection, establishing electrical connections through integrated contacts, enabling surface mounting via SMT-compatible geometry, and offering ESD protection through the integrated protective chip. This multi-functional design reduces the need for separate components and reduces overall production cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If separate through contacts extending through the molded body are used for electrical connections, then reliable electrical connectivity is achieved, but the component dimensions increase and production complexity increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidproduction complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the electrical connection function from the housing structure and integrates it directly into the chip substrate. The electrical contacts are formed as part of the chip structure itself rather than as separate elements extending through the molded body, simplifying the overall device complexity while maintaining reliable electrical connectivity.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If wiring is arranged on the under side of the semiconductor component for electrical connections, then electrical connectivity is established, but the production cost increases and the component geometry becomes more complex

Engineering Contradiction:

Improveelectrical connectivityVSAvoidproduction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Instead of arranging wiring on the under side of the component as in conventional designs, the patent inverts the approach by forming electrical contacts on the front surface of the chip substrate. This inversion eliminates the need for separate wiring layers and reduces production cost while maintaining reliable electrical connectivity.

Inventive Principle:

Principle #13The other way round (Inversion)

4Volume of moving object

If the component is designed for surface mounting with compact dimensions, then space efficiency is improved, but the housing structure becomes more complex

Engineering Contradiction:

Improvecomponent dimensionsVSAvoidhousing structure

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into the housing structure: mechanical protection, electrical connections through integrated contacts, and mounting interfaces for surface mounting. This merging of functions into a single integrated structure achieves compact dimensions suitable for surface mounting while actually reducing overall device complexity compared to conventional designs with separate components.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9978733B2Optoelectronic semiconductor component and method for producing same

Publication Date: 2018.05.22 OSRAM OLED

AI summary

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip with a first surface and a second surface. The component also includes a protective chip which has a protective diode, a first surface and a second surface. The semiconductor chip and the protective chip are embedded in a molded body. A first electrical contact and a second electrical contact are arranged on the first surface of the semiconductor chip. A third electrical contact and a fourth electrical contact are arranged on the first surface of the protective chip. The first electrical contact is electrically connected to the third electrical contact. In addition, the second electrical contact is electrically connected to the fourth electrical contact.