Optoelectronic Semiconductor Component Singulation via Molding Compound

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Solution Overview

Problem

The complexity and cost of producing optoelectronic semiconductor components are increased due to varying production steps based on component size, necessitating a method that is simple and reliable, independent of size, while maintaining good optoelectronic properties.

Innovation Solution

A method involving a semiconductor layer sequence with mechanically connected component areas, forming connecting surfaces, filling interstices with a molding compound, singulating to form molded bodies, and overmolding to cover connecting surfaces, allowing for the production of optoelectronic semiconductor components with adjustable lateral extension and integrated packaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If various production steps are employed depending on the size of semiconductor components, then the packaging can be adapted to different component sizes, but the overall complexity of the production method and associated costs increase

Engineering Contradiction:

Improvepackaging adaptation to different component sizesVSAvoidproduction method complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies a universal production method that can handle different component sizes using the same basic process steps. The molding compound and packaging structure serve multiple functions across different LED sizes without requiring size-specific production variations, thereby reducing complexity while maintaining adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The production method segments the packaging process into distinct, standardized steps (forming connecting surfaces, applying molding compound, singulation) that can be consistently applied regardless of component size. This segmentation allows the same process framework to accommodate various LED sizes without increasing overall complexity.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If various production steps are employed depending on the size of semiconductor components, then the packaging can be adapted to different component sizes, but the associated costs increase

Engineering Contradiction:

Improvepackaging adaptation to different component sizesVSAvoidproduction cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By using a universal production method that works for different component sizes, the patent eliminates the need for multiple size-specific process variants. This universality reduces manufacturing costs by standardizing the production流程 while maintaining the ability to package different LED sizes effectively.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Stability of the object's composition

If connecting surfaces are formed on semiconductor layer sequence, then mechanical stability is improved, but additional production steps are required

Engineering Contradiction:

Improvemechanical stabilityVSAvoidproduction steps

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The formation of connecting surfaces is merged with the existing semiconductor layer sequence structure. The connecting surfaces are created as an integrated part of the layer sequence preparation process rather than as a separate, complex additional step, thereby improving mechanical stability without significantly increasing production complexity.

Inventive Principle:

Principle #5Merging (Combining)

4Stability of the object's composition

If molding compound fills interstices between connecting surfaces, then mechanical stability and packaging integrity are improved, but production time and process complexity increase

Engineering Contradiction:

Improvepackaging integrityVSAvoidproduction time

Core Design Contradiction:

Stability of the object's compositionVSLoss of time

Solution Approach 1:

The molding compound is applied to fill interstices between connecting surfaces during the main production process before final assembly. This preliminary action ensures packaging integrity is established early, preventing the need for additional corrective steps later and reducing overall production time.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS10361345B2Method of producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component

Publication Date: 2019.07.23 OSRAM OLED

AI summary

A method of producing a plurality of optoelectronic semiconductor components includes a) preparing a composite with a semiconductor layer sequence, wherein the composite includes a plurality of component areas mechanically connected to one another; b) forming a plurality of connecting surfaces on the semiconductor layer sequence, wherein at least one connecting surface is formed on each component area; c) forming a molding compound on the semiconductor layer sequence, wherein the molding compound fills interstices between the connecting surfaces; and d) singulating the composite with the molding compound, wherein during singulation a plurality of molded bodies is formed from the molding compound, each of which is associated with a semiconductor body obtained from a component area of the composite.