Optoelectronic Through-Contact Anchoring via Curved Geometry
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Solution Overview
Problem
Existing optoelectronic semiconductor components face challenges in securely anchoring through-contacts within molded bodies, leading to potential displacement and instability, especially when subjected to mechanical stress or damage.
Innovation Solution
The through-contact is configured in various forms such as folded or bent strips, spirals, or connected conduction elements, which provide enhanced anchoring and elasticity, allowing for a larger conduction cross-sectional area and improved stability, with options for parallel or perpendicular arrangements to the axis of the through-contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a straight through-contact is used, then the manufacturing is simple, but the anchoring in the molded body is weak and displacement occurs
Solution Approach 1:
The through-contact is configured with curved or spiral geometry instead of a straight line. This curvature increases the surface area in contact with the molded body, creating better mechanical interlocking and preventing displacement while maintaining manufacturing feasibility through standard winding or forming processes.
Solution Approach 2:
The through-contact extends beyond a simple linear path by incorporating spiral or folded configurations that utilize three-dimensional space within the molded body. This dimensional expansion provides multiple anchoring points along the length of the contact, significantly improving stability without complicating the manufacturing process.
2Reliability
If the conduction cross-sectional area is increased, then the electrical resistance is reduced, but the device complexity increases
Solution Approach 1:
The spiral or curved configuration of the through-contact naturally increases the effective conduction cross-sectional area by distributing the current path across multiple segments. This geometric approach achieves lower electrical resistance without requiring additional materials or complex multi-layer structures, maintaining manufacturing simplicity.
Solution Approach 2:
The functional requirements of mechanical anchoring and electrical conduction are merged into a single integrated spiral structure. This through-contact simultaneously provides structural stability through its curved geometry and electrical connectivity through its continuous conductive path, eliminating the need for separate anchoring elements and reducing overall device complexity.
3Stability of the object's composition
If the through-contact is made rigid for stability, then the positioning is precise, but the adaptability to different chip thicknesses is reduced
Solution Approach 1:
The through-contact incorporates flexible or elastically deformable sections that allow dynamic adjustment to different semiconductor chip thicknesses. These sections can bend or flex during assembly to accommodate varying chip dimensions, then maintain stable electrical and mechanical connections once positioned, providing both adaptability and stability.
Solution Approach 2:
The through-contact utilizes flexible metallic strips or thin-film structures that can elastically deform to adapt to different chip thicknesses during the molding process. After assembly, these flexible sections maintain sufficient rigidity to provide stable positioning and reliable electrical connections, combining adaptability with positional stability.
Data Source
AI summary
An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the component includes a semiconductor chip, a molded body and an electrical through-contact constituting an electrically conductive connection through the molded body. The through-contact and the semiconductor chip are embedded alongside one another and are spaced apart in the molded body. A first contact pad of the through-contact is arranged at an underside of the molded body. A second contact pad of the through-contact is arranged at a top side of the molded body. The second contact pad is electrically conductively connected to the electrical contact of the semiconductor chip. The through-contact is arranged such that a molded body is arranged at least in a section between the first and second contact pads on a straight line between the first and second contact pads.