Optoelectronic Component Transfer With Sequential Placement Accuracy
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Solution Overview
Problem
The existing methods for transferring optoelectronic semiconductor components from a donor substrate to a target substrate are time-consuming and costly due to the need for frequent movement of a transfer head over long distances, which affects transfer performance and accuracy, especially for larger displays with larger pixel pitches.
Innovation Solution
A method involving a transfer unit that lifts multiple optoelectronic semiconductor components from a first carrier and places them on a second carrier with periodically arranged contact surfaces, allowing for sequential placement without returning to the first carrier, reducing travel distance and time, and using a contact structure with protrusions or bonding layers for mechanical and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transfer head speed and size are increased to improve transfer rate, then productivity increases, but transfer performance and placement accuracy deteriorate
Solution Approach 1:
The patent divides the transfer process into two distinct phases: a picking phase where the transfer head collects semiconductor components from the donor substrate, and a placement phase where components are deposited onto the target substrate. This segmentation allows the transfer head to be optimized for high-speed picking while maintaining precision during the controlled placement phase, resolving the contradiction between transfer rate and placement accuracy.
2Adaptability or versatility
If the transfer head moves frequently over long distances to transfer components with large pixel pitch, then adaptability to larger displays improves, but loss of time increases
Solution Approach 1:
The patent implements a continuous transfer process where the transfer head picks up components from the donor substrate and deposits them onto the target substrate in a seamless operation. The transfer head maintains continuous contact with the substrates during the transfer process, eliminating idle movement time and maintaining high productivity even when transferring components with large pixel pitch to larger displays.
Data Source
AI summary
In an embodiment a method includes providing a plurality of optoelectronic semiconductor components on a first carrier, providing a second carrier comprising a contact structure with a plurality of periodically arranged contact surfaces on its top surface, accommodating the plurality of optoelectronic semiconductor components by a transfer unit including placing the transfer unit on a top surface of the optoelectronic semiconductor components opposite to the first carrier, lifting the plurality of optoelectronic semiconductor components from the first carrier, placing a first subset of the plurality of optoelectronic semiconductor components on a first subset of the plurality of periodically arranged contact surfaces and fixing the first subset of the plurality of optoelectronic semiconductor components on the first subset of the plurality of periodically arranged contact surfaces.