Optoelectronic Semiconductor Components Trench Support

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Solution Overview

Problem

Conventional optoelectronic semiconductor components lack mechanical stability and fail to achieve high radiation contrast due to soft, highly reflective encapsulation materials, and prefabricated packages are expensive.

Innovation Solution

A method involving the application of optoelectronic semiconductor chips to a carrier, followed by a two-step potting process where a reflective potting material is used initially to create trenches, and then filled with a supporting material that enhances mechanical stability and optical contrast, reducing overpotting and allowing for cost-effective parallel processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a soft, highly reflective encapsulation material is used, then optical contrast is improved, but mechanical stability deteriorates

Engineering Contradiction:

Improveradiation contrastVSAvoidmechanical stability

Core Design Contradiction:

Illumination intensityVSStrength

Solution Approach 1:

The encapsulation structure is segmented into two distinct materials: a soft, highly reflective first encapsulation material that provides optical contrast, and a rigid supporting material that provides mechanical stability. This segmentation allows each material to perform its specialized function without compromise.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses a composite encapsulation structure combining two materials with complementary properties: the first encapsulation material (soft, reflective) and the supporting material (rigid, mechanically stable). This composite approach resolves the contradiction by integrating the advantages of both materials in a single functional system.

Inventive Principle:

Principle #40Composite materials

2Strength

If prefabricated packages are used, then mechanical stability is improved, but manufacturing cost deteriorates

Engineering Contradiction:

Improvemechanical stabilityVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The supporting material is introduced during the encapsulation process itself, before final assembly is complete. This preliminary action allows the rigid support structure to be integrated into the manufacturing flow, eliminating the need for separate prefabricated packages and reducing overall manufacturing cost.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention merges the encapsulation function and mechanical support function into a single integrated structure. The supporting material serves dual purposes: providing mechanical stability and forming part of the encapsulation, thereby eliminating the need for separate prefabricated packages.

Inventive Principle:

Principle #5Merging (Combining)

3Strength

If trenches are filled with supporting material, then mechanical stability is improved, but device complexity deteriorates

Engineering Contradiction:

Improvemechanical stabilityVSAvoidstructure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The supporting material is placed locally in trenches only where mechanical reinforcement is needed, rather than uniformly throughout the entire encapsulation. This localized approach provides mechanical stability precisely where required while maintaining simplicity in other regions.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The encapsulation structure is segmented into regions with different material properties: trenches filled with rigid supporting material for mechanical strength, and surrounding areas with soft reflective material for optical performance. This functional segmentation optimizes both stability and simplicity.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves higher mechanical stability and contrast in optoelectronic semiconductor components without introducing mechanical weak points, while reducing costs by optimizing the supporting material's mechanical properties over optical requirements and enabling efficient panel-level processing.

Implementation Method 1

the potting, and consequently the potting material, is reflective with respect to the radiation generated by the semiconductor chips during operation

Methodology Applied

Scientific EffectReflection: Reflection

Data Source

PatentUS11670745B2Method for producing optoelectronic semiconductor components, and optoelectronic semiconductor component

Publication Date: 2023.06.06 AMS OSRAM INT GMBH

AI summary

A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.