Optoelectronic Component Wavelength Conversion Layer Adhesive Bonding
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Solution Overview
Problem
Existing methods for producing optoelectronic components with radiation-emitting and wavelength conversion layers face challenges in separate production and integration without damaging the radiation-emitting layer sequence, particularly due to processes like thermal treatment or UV irradiation that can harm the sequence.
Innovation Solution
A method involving separate production of a radiation-emitting layer sequence and a wavelength conversion layer, where the wavelength conversion layer is arranged in the beam path using adhesive bonding or lamination, with the wavelength conversion material and binder applied to a carrier substrate, allowing for durable connection and independent processing steps that avoid damaging the radiation-emitting layer sequence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermal treatment or UV irradiation is applied to provide the wavelength conversion layer, then the wavelength conversion efficiency is improved, but the radiation-emitting layer sequence is damaged
Solution Approach 1:
The patent divides the manufacturing process into separate stages: the radiation-emitting layer sequence is manufactured first and protected, then the wavelength conversion layer is applied separately in a subsequent step. This segmentation allows harsh processing conditions (thermal treatment, UV irradiation) to be applied to the wavelength conversion layer without damaging the radiation-emitting layer sequence, as they are processed independently and assembled together later.
Solution Approach 2:
The radiation-emitting layer sequence is manufactured and protected in advance before the wavelength conversion layer is applied. This preliminary action allows the radiation-emitting layer sequence to be shielded from harmful processing conditions that will later be applied to the wavelength conversion layer, ensuring its integrity while enabling effective wavelength conversion processing.
2Device complexity
If the wavelength conversion layer is applied early in the manufacturing process, then integration is simplified, but the radiation-emitting layer sequence cannot be processed independently
Solution Approach 1:
The patent segments the manufacturing process into independent stages where the radiation-emitting layer sequence and wavelength conversion layer are produced separately and then integrated. This allows each component to be optimized and processed independently with appropriate techniques, while the final integration step combines them into the complete optoelectronic component.
3Ease of manufacture
If harsh processing conditions are used for the wavelength conversion layer, then conversion efficiency is improved, but the overall component reliability decreases
Solution Approach 1:
By separating the manufacturing processes into independent stages, the patent enables harsh processing conditions (thermal treatment, UV irradiation) to be applied to the wavelength conversion layer without exposing the radiation-emitting layer sequence to these damaging conditions. This segmentation maintains component reliability while achieving effective wavelength conversion.
Solution Approach 2:
The radiation-emitting layer sequence is protected in advance by completing its manufacturing and shielding it before the wavelength conversion layer undergoes harsh processing. This prior protection cushions the radiation-emitting layer sequence from harmful effects, maintaining its functionality while allowing aggressive processing of the wavelength conversion layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of optoelectronic components with efficient wavelength conversion and durable connections, allowing for the creation of components that emit primary and secondary radiation, providing a polychromatic light impression and enabling the production of different-colored components with varied dimensions and mixtures of wavelength conversion materials.
Implementation Method 1
a first wavelength conversion layer (2), which converts the primary radiation at least partially into electromagnetic secondary radiation
Implementation Method 2
Arrangement of the first wavelength conversion layer on the radiation-emitting layer sequence in the beam path of the primary radiation may here comprise attachment of the first wavelength conversion layer to the radiation-emitting layer sequence by adhesive bonding
Data Source
AI summary
A method of producing an optoelectronic component comprises the steps of: A) providing a radiation-emitting layer sequence (1) having an active zone (13), which emits electromagnetic primary radiation when in operation, B) providing a first wavelength conversion layer (2), which converts the primary radiation at least partially into electromagnetic secondary radiation, and C) arranging the first wavelength conversion layer (2) on the radiation-emitting layer sequence (1) in the beam path of the primary radiation.