Organic Bridge Chip Package Structure for Uniform Bump Assembly
Solution Overview
Problem
The existing chip package structures using embedded multi-die interconnect bridge (EMIB) technology face a low assembly yield rate due to size differences between micro bumps on silicon bridges and circuit substrates, leading to poor structural reliability.
Innovation Solution
A chip packaging structure with uniform-sized bumps between chips and a substrate, utilizing a high-molecular polymer bridge with a pad layer, which allows for consistent electrical connections and improved assembly yield, enhancing structural reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon bridge is used to connect chips on circuit carrier, then chip interconnection is achieved, but pad size becomes significantly smaller than general circuit board pads, resulting in different micro bump sizes and poor assembly yield rate
Solution Approach 1:
The patent changes the material parameter from silicon bridge to organic bridge, which fundamentally alters the pad size characteristics. The organic bridge material enables pad sizes that are consistent with general circuit boards, thereby unifying micro bump sizes across all connections and improving assembly yield rate
Solution Approach 2:
The patent discards the silicon bridge technology that caused pad size inconsistency and recovers/adopts organic bridge material instead. This material substitution resolves the fundamental issue of varying pad sizes and enables consistent micro bump dimensions throughout the package structure
2Reliability
If different sized micro bumps are used between silicon bridge and chips versus chips and circuit substrate, then connection is possible, but structural reliability deteriorates
Solution Approach 1:
The patent applies homogeneity by ensuring all micro bumps in the package structure have the same size. By using organic bridge material, the pad dimensions are unified across all connection points, eliminating the need for different bump sizes and thereby improving structural reliability
Solution Approach 2:
The organic bridge material serves multiple functions: it provides mechanical support, electrical connection, and enables standardized pad sizes that work with both chips and circuit substrates. This universal compatibility eliminates the need for specialized different-sized bumps for different connection types
Data Source
AI summary
A chip package structure includes a substrate, a first chip, a second chip, a bridge, a plurality of first bumps, a plurality of second bumps, a plurality of third bumps and a plurality of solder balls. A first active surface of the first chip and a second active surface of the second chip face a first surface of the substrate. The bridge includes a high-molecular polymer layer and a pad layer located on the high-molecular polymer layer. The first chip is electrically connected to the substrate through the first bumps. The second chip is electrically connected to the substrate through the second bumps. The first chip and the second chip are electrically connected to the pad layer through the third bumps. The first bumps and the second bumps have the same size. The solder balls are disposed on a second surface of the substrate and electrically connected to the substrate.