Organic Electronic Encapsulation with Getter Adhesive Layer

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Solution Overview

Problem

Organic electronic devices, such as OLEDs, are highly sensitive to moisture and oxygen, leading to premature failure due to inadequate encapsulation methods that fail to effectively retard diffusion and protect against environmental influences.

Innovation Solution

A multi-layer encapsulation system comprising a thin-layer encapsulation, a first adhesive layer with getter material, and a covering layer, which enhances adhesion and significantly retards oxygen and water diffusion, while also improving mechanical protection and heat dissipation, thereby extending the service life of organic electronic devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a thin-layer encapsulation is used to protect against moisture and oxygen, then the device structure is simplified and manufacturing is easier, but the encapsulation effectiveness is insufficient and service life is reduced

Engineering Contradiction:
Improveencapsulation manufacturing simplicityVSAvoidencapsulation effectiveness
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies composite materials by combining the thin-layer encapsulation with an adhesive layer containing getter material. This composite structure integrates the barrier function of the thin-layer encapsulation with the moisture and oxygen absorption capability of the getter material, achieving both ease of manufacture and high reliability without requiring complex multi-step processes.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The adhesive layer is designed to serve multiple functions: it provides adhesion between layers, acts as a barrier to moisture and oxygen diffusion, and contains getter material for active absorption of residual oxygen and water. This multi-functionality resolves the contradiction by enhancing encapsulation effectiveness without adding separate components or complicating manufacturing.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If an adhesive layer with getter material is added to the encapsulation, then oxygen and water diffusion is retarded and service life is increased, but the device structure becomes more complex

Engineering Contradiction:
Improveservice lifeVSAvoidencapsulation structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the adhesive function and the getter material function into a single integrated layer. Rather than adding a separate adhesive layer and a separate getter layer, the getter material is incorporated directly into the adhesive layer, thereby retarding oxygen and water diffusion without significantly increasing structural complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adhesive layer performs multiple functions simultaneously: structural adhesion, diffusion barrier, and active gettering of oxygen and water. This multi-functionality allows the encapsulation to achieve enhanced service life while maintaining relatively simple structure, as one layer accomplishes what would otherwise require multiple separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If the adhesive layer contains getter material, then adhesion and moisture repulsion are improved, but the manufacturing process becomes more difficult

Engineering Contradiction:
Improveadhesion and moisture repulsionVSAvoidmanufacturing process difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies parameter changes by modifying the chemical composition of the adhesive layer to include getter material. This changes the material properties to provide both adhesion and moisture repulsion simultaneously. The manufacturing process remains relatively simple as it involves standard coating and curing techniques, but with enhanced material formulation that delivers improved reliability without significantly increasing process difficulty.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The encapsulation system effectively prevents moisture and oxygen ingress, enhances adhesion, and improves heat dissipation, resulting in a substantial increase in the service life of organic electronic devices by creating a robust barrier against environmental factors.

Implementation Method 1

A 'getter material' is a material which absorbs or adsorbs disruptive substances penetrating from outside, such as, e.g., oxygen or the water of atmospheric moisture

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Implementation Method 2

A 'getter material' is a material which absorbs or adsorbs disruptive substances penetrating from outside

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 3

the at least one thin-layer encapsulation and the at least one first adhesive layer and the at least one covering layer can lead to a retardation in oxygen and water diffusion

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Data Source

PatentUS9601721B2Encapsulation for an organic electronic device
Publication Date: 2017.03.21 DOLYA HOLDCO 5 LTD
  • US9601721B2 patent drawing
  • US9601721B2 patent drawing
  • US9601721B2 patent drawing

AI summary

An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.