Organic Interposer Metallic Shield Structures for Stress Resistance
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Solution Overview
Problem
Fan-out wafer level packages (FOWLPs) face mechanical stress issues during the attachment of semiconductor dies and package substrates, leading to potential deformation or breakage of organic interposers due to underfill material application, which compromises the structural integrity of redistribution interconnect structures.
Innovation Solution
Incorporating metallic shield structures supported by shield support via structures around die-side bump structures to provide mechanical support during underfill material application and handling, using a combination of metallic pad structures, base plates, and polymer matrix layers to enhance the structural resilience of organic interposers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metallic shield structures and support via structures are added to enhance mechanical strength, then structural integrity is improved, but device complexity increases
Solution Approach 1:
The metallic shield structures and support via structures are formed during the interposer fabrication process before the underfill material is applied. This preliminary formation of reinforcement structures allows the interposer to withstand the mechanical stress of underfill application without requiring additional processing steps after bonding, thus improving structural integrity while managing overall device complexity
Solution Approach 2:
The interposer uses a composite structure combining organic polymer matrix layers with metallic reinforcement elements (shield structures and support via structures). This composite approach allows the organic material to provide flexibility and electrical insulation while the metallic components provide enhanced mechanical strength and stress resistance, resolving the contradiction between strength and complexity
2Ease of manufacture
If the organic interposer structure is simplified to reduce manufacturing complexity, then ease of manufacture is improved, but mechanical strength deteriorates under bonding stress
Solution Approach 1:
The interposer is segmented into distinct functional layers: organic polymer matrix layers for flexibility and insulation, metallic shield structures for stress resistance, and support via structures for mechanical anchoring. This segmentation allows each component to be optimized for its specific function while maintaining overall ease of manufacture through modular fabrication processes
Solution Approach 2:
The metallic shield structures are strategically positioned in high-stress regions of the interposer, such as around bonding pads and along stress concentration zones. This local reinforcement approach provides enhanced mechanical strength where needed most while keeping other regions of the interposer simpler and easier to manufacture
Data Source
AI summary
An organic interposer includes polymer matrix layers embedding redistribution interconnect structures, package-side bump structures, die-side bump structures and connected to a distal subset of the redistribution interconnect structures through a respective bump connection via structure. At least one metallic shield structure may laterally surround a respective one of the die-side bump structures. Shield support via structures may laterally surround a respective one of the bump connection via structures. Each metallic shield structure and the shield support via structures may be used to reduce mechanical stress applied to the redistribution interconnect structures during subsequent attachment of a semiconductor die to the die-side bump structures.