Organic Layer Height Adjustment for Bending Stress Relief
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Solution Overview
Problem
In the fabrication of thin film transistor (TFT) backplane for low temperature poly-silicon organic light emitting diodes (LTPS-OLED), the wiring layer breaks during bending due to uneven stress release, significantly affecting the yield of the light emitting panel.
Innovation Solution
A light emitting panel design where the organic layer has a greater vertical height than the transistor layer, with extending portions forming a resisting structure, to redistribute stress and protect the wiring layer, thereby improving bendability and reducing breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a deep hole is etched in the Pad bending zone and filled with organic dry hole material to enhance bendability, then the bendability of the light emitting panel is improved, but the wiring layer on the organic dry hole material will be broken during bending
Solution Approach 1:
The invention changes the vertical height parameter of the organic layer, making it greater than the vertical height of the transistor layer. This parameter modification allows the organic layer to effectively buffer and release stress during bending, protecting the wiring layer while maintaining panel flexibility
Solution Approach 2:
The organic layer serves as a pre-established cushioning structure between the substrate and the wiring layer. During bending, this organic layer absorbs and distributes stress before it reaches the wiring layer, preventing breakage through advance stress buffering
Data Source
AI summary
Disclosed is a light emitting panel and a display device. The light emitting panel includes a substrate, wherein the substrate comprises a display area, a non-display area and a bending area connecting the display area and the non-display area; a transistor layer, wherein the transistor layer is disposed on the substrate and disposed relative to the display area and the non-display area; an organic layer, wherein the organic layer is disposed on the substrate and disposed relative to the bending area; and a wiring layer, wherein the wiring layer is disposed on the organic layer; wherein a vertical height of the organic layer is greater than a vertical height of the transistor layer.