Sealing Layer Opening Structure for Organic Device Bonding
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Solution Overview
Problem
The reliability of organic devices is compromised due to the deterioration of organic compounds by water, and increasing the thickness of the sealing layer to address this issue leads to bonding failures during the connection of wiring to pad electrodes.
Innovation Solution
An organic device with a sealing layer that includes a specific opening structure, featuring a first portion extending from the upper surface towards the pad electrode and a second portion with an outer edge inside the outer edge of the pad electrode, allowing for the use of conductive particles larger than the second portion's height for electrical connection, thereby reducing the step size and preventing bonding failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the sealing layer is increased to improve reliability, then the protection against water deterioration is improved, but the step of the opening for exposing the pad electrode increases and bonding failure may occur
Solution Approach 1:
The opening is divided into two distinct portions: a first portion extending from the upper surface of the sealing layer towards the pad electrode, and a second portion opening from the lower end of the first portion to the pad electrode. This segmentation allows the opening to accommodate the thick sealing layer while maintaining a manageable step size at the bonding interface, as the conductive particle can bridge the gap through the two-stage structure without encountering a single large step that would cause bonding failure.
Solution Approach 2:
The opening structure transitions from a simple vertical hole to a two-stage three-dimensional structure with the first portion and second portion arranged in sequence. This dimensional change allows the opening to effectively penetrate through the thick sealing layer while controlling the step height at each stage, enabling both reliable sealing and successful bonding operations.
2Reliability
If the thickness of the sealing layer is increased to improve reliability, then the protection against water deterioration is improved, but the step size of the opening increases leading to bonding failure
Solution Approach 1:
The opening is segmented into a first portion and a second portion, where the first portion handles the bulk of the sealing layer penetration and the second portion provides a controlled access path to the pad electrode. This segmentation reduces the step size that the conductive particle must bridge, thereby maintaining bonding precision even when the overall sealing layer thickness is increased for improved reliability.
Solution Approach 2:
The two-stage opening structure acts as an intermediary between the thick sealing layer and the pad electrode bonding interface. The first portion and second portion together form a transitional pathway that accommodates the thickness requirement while maintaining the precision needed for successful conductive particle bonding to the pad electrode.
Data Source
AI summary
An organic device comprising a pixel region in which pixels are arranged, a peripheral region including a pad electrode, and a sealing layer arranged to cover the pixel and peripheral regions, is provided. In the peripheral region, an opening of the sealing layer is formed. The opening comprises a first portion extending from a plane defined by an upper surface of the sealing layer towards the pad electrode, and a second portion which has an outer edge inside outer edges of the first portion and the pad electrode and opens from a lower end of the first portion to the pad electrode. A conductive particle for electrical connection to an electrode is arranged on the pad electrode, and a diameter of the conductive particle is larger than a height of the second portion.