Organic Semiconductor Composition for Low-Variance Thin Film Transistors

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Solution Overview

Problem

Current methods for manufacturing organic thin film transistors using organic semiconductor materials face challenges in achieving small variance in mobility and threshold value while maintaining high mobility, particularly due to limitations in solubility and processing techniques.

Innovation Solution

An organic semiconductor composition is developed, comprising an organic semiconductor compound, an insulation compound, a good solvent, and a poor solvent with a higher boiling point, where the content mass ratio of the solvents is optimized, and the solubility and Hansen solubility parameters are specifically tailored to enhance film formation and device performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional organic semiconductor materials are used, then solubility in organic solvents is poor, but manufacturing cost increases due to expensive vacuum deposition methods

Engineering Contradiction:
Improvemanufacturing costVSAvoidsolubility
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent uses composite materials by combining the organic semiconductor compound with a polymer material to form a soluble composite. This allows the material to be dissolved in organic solvents while maintaining semiconductor properties, enabling low-cost solution processing methods like spin coating and printing to replace expensive vacuum deposition

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent introduces a polymer material as an intermediary carrier to enable solubility. The polymer acts as a matrix that accommodates the semiconductor compound, allowing the mixture to be dissolved in organic solvents without compromising the semiconductor's functional properties

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If organic semiconductor materials are used, then low temperature processing is enabled, but variance in mobility and threshold value remains large

Engineering Contradiction:
Improveprocessing temperatureVSAvoidmobility variance
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The patent optimizes multiple parameters including the ratio of organic semiconductor compound to polymer material, the selection of organic solvent type, and processing conditions. By systematically adjusting these parameters, the invention achieves both low temperature processing and reduced variance in mobility and threshold value

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent achieves uniform local quality throughout the film by optimizing the solution composition and processing parameters. This ensures consistent molecular distribution and film morphology across the entire substrate, reducing property variance while maintaining low processing temperatures

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If organic semiconductor materials are used, then flexible and lightweight devices are achieved, but solubility limitations prevent use of inexpensive application methods

Engineering Contradiction:
Improvesubstrate flexibilityVSAvoidapplication method cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By creating a composite of organic semiconductor compound and polymer material, the invention achieves both the flexibility needed for diverse substrates and the solubility required for inexpensive application methods. The composite can be processed using spin coating, printing, and other low-cost techniques while maintaining device performance

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The polymer material serves as an intermediary that enables compatibility between the semiconductor compound and organic solvents. This intermediary allows the use of inexpensive solution-based application methods while preserving the semiconductor functionality and enabling flexible device design

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the production of organic thin film transistors with small variance in mobility and threshold value while maintaining high mobility, facilitating practical and cost-effective large-area field effect transistors.

Implementation Method 1

an organic solvent A which is a good solvent for the insulation compound

Methodology Applied
Scientific EffectSolubility: Solvation

Implementation Method 2

an organic solvent B which is a poor solvent for the insulation compound

Methodology Applied
Scientific EffectPrecipitation: Precipitation

Implementation Method 3

a poor solvent for the insulation compound and has a higher boiling point than the organic solvent A

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS11495744B2Organic semiconductor composition, organic thin film, and organic thin film transistor
Publication Date: 2022.11.08 NIPPON KAYAKU CO LTD
  • US11495744B2 patent drawing
  • US11495744B2 patent drawing
  • US11495744B2 patent drawing

AI summary

The purpose of the present invention is to provide: an organic semiconductor composition suitable for preparing an organic thin film by a solution method, an organic thin film obtained by using the organic semiconductor composition, and a practical field effect transistor which uses the organic thin film. The practical field effect transistor which uses the organic thin film has small variances in mobility and a threshold value, while maintaining a high mobility. Disclosed in the present specification is an organic semiconductor composition including an organic semiconductor compound, an insulation compound, an organic solvent A, which is a good solvent for the insulation compound, and an organic solvent B, which is a poor solvent for the insulation compound and has a higher boiling point than the organic solvent A. The mass ratio a:b of the organic solvent A and the organic solvent B is 1:8 to 8:1.