Organic Substrate Image Sensor Package for Impact Resistance
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Solution Overview
Problem
Conventional image sensor packages using the Chip-On-Glass method are vulnerable to physical impact due to low elastic strain and have high production costs, making them difficult to slenderize and protect effectively.
Innovation Solution
An image sensor package with a substrate made of organic material, capable of elastic deformation, is used for flip-chip bonding with the image sensor chip, featuring a hole for light transmission and a protective case to enhance physical impact resistance and reduce manufacturing costs by eliminating the need for wire bonding and complex assembly processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the Chip-On-Glass method is used with a transparent substrate, then light transmission is enabled, but the package becomes vulnerable to physical impact due to low elastic strain
Solution Approach 1:
The patent changes the material parameter of the substrate from glass to organic material, which fundamentally alters the elastic strain characteristics. The organic substrate provides higher elastic strain capability while maintaining light transmission properties, thus resolving the contradiction between light transmission and physical impact resistance.
Solution Approach 2:
The patent employs composite material structure by combining organic substrate material with appropriate mechanical properties. This composite approach enables the substrate to simultaneously achieve optical transparency for light transmission and enhanced mechanical flexibility for impact resistance.
2Ease of manufacture
If the Chip-On-Board method with bonding wires is used, then electrical connection is achieved, but the overall height increases due to the bonding wire height
Solution Approach 1:
The patent extracts and eliminates the bonding wire component from the package structure. By using flip-chip bonding technology, the electrical connection is achieved directly through solder bumps without requiring separate bonding wires, thus removing the source of height increase while maintaining electrical connectivity.
Solution Approach 2:
The patent replaces the wire bonding mechanical system with a direct flip-chip bonding system. Instead of using flexible bonding wires to create electrical connections, the method uses rigid solder bumps that enable both electrical connection and height reduction simultaneously.
3Illumination intensity
If the conventional Chip-On-Glass method is used, then light transmission is enabled, but production costs increase due to complex assembly processes
Solution Approach 1:
The patent changes the substrate material parameter from glass to organic material, which simplifies the manufacturing process. The organic substrate can be processed using more straightforward fabrication techniques compared to glass, reducing assembly complexity and production costs while maintaining optical transparency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of image sensor packages against physical impact while allowing for slenderization and reduces processing costs by using organic substrates with thermal expansion matching silicon wafers and integrating a protective case for enhanced durability.
Implementation Method 1
capable of elastic deformation
Implementation Method 2
solder bumps configured to electrically connect the image sensor chip to the substrate
Implementation Method 3
provided with a hole formed at a position facing the pixel domain
Data Source
AI summary
An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image sensor chip provided with a pixel domain at a central portion of an upper surface thereof, a substrate disposed at an upper side of the image sensor chip so as to be flip-chip bonded with respect to the image sensor chip, provided with a hole formed at a position corresponding to the pixel domain, and formed of organic material, a printed circuit board at which the substrate provided with the image sensor chip bonded thereto is mounted, and a solder ball configured to electrically connect the substrate to the printed circuit board.