Organic Substrate Semiconductor Device with Protruding Support Member
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Solution Overview
Problem
Semiconductor devices with flip-chip connected chips face reliability issues due to stress and deformation caused by the weight of the package, particularly at the solder ball-connected portions, which affects the connection reliability and is exacerbated by the difference in thermal expansion coefficients between the resin substrate and the semiconductor chip.
Innovation Solution
The semiconductor device incorporates an organic material-based substrate with a semiconductor chip flip-chip connected to its center, a resin filling the space between the chip and the substrate, a lid member fixed to the substrate's periphery, and a substrate support member that protrudes beyond the substrate's thickness to secure a stand-off and balance deformation restrictions, reducing stress and improving mounting reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the package structure is made large with heat sink, then heat dissipation is improved, but deformation of solder ball connected portions occurs due to package weight
Solution Approach 1:
The patent introduces a support member that extends from the lid through the organic substrate to provide mechanical support and counterbalance the weight of the package structure. This support member prevents excessive deformation of the solder ball connected portions by distributing the mechanical load, thereby resolving the contradiction between large package size for heat dissipation and maintaining solder ball connection reliability.
2Stability of the object's composition
If resin is filled in the space between resin substrate and semiconductor chip, then deformation restriction is improved, but stress concentration occurs at corner portions and back surface
Solution Approach 1:
The patent introduces a support member positioned specifically at the back surface of the organic substrate, opposite to the semiconductor chip location. This localized structural reinforcement provides additional support where stress concentration occurs due to thermal expansion differences, distributing the stress more evenly while maintaining the deformation restriction benefits of the resin fill.
3Productivity
If semiconductor chip is flip-chip connected at center of substrate, then connection density is improved, but stress and deformation occur at solder ball portions due to thermal expansion difference
Solution Approach 1:
The support member extending through the organic substrate acts as a mechanical counterbalance that compensates for the stress and deformation caused by thermal expansion differences between the semiconductor chip and substrate. This allows the flip-chip center-mounted configuration to maintain high connection density while the support member prevents excessive stress concentration that would compromise mounting reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decreases deformation and stress at the solder ball-connected portions, enhancing the reliability of the semiconductor device's connection to a mounting wiring board by balancing deformation restrictions from both sides of the substrate, thereby improving the overall mounting reliability.
Implementation Method 1
a thermal expansion coefficient is largely different between the resin substrate and the semiconductor chip
Data Source
AI summary
Disclosed is a semiconductor device, including an organic material-based substrate; a semiconductor chip, flip-chip connected to substantially a center of one surface side of the organic material-based substrate; a resin disposed to fill a space between the semiconductor chip and the organic material-based substrate; a lid member fixed to an outer peripheral region of a region the semiconductor chip is positioned at, on the one surface side of the organic material-based substrate to which the semiconductor chip is flip-chip connected and also fixed to the semiconductor chip in a side opposite to a flip-chip connected side of the flip-chip connected semiconductor chip; and a substrate support member disposed to extend from a vicinity of a portion of the lid member, the portion being fixed to the organic material-based substrate, and to protrude beyond a thickness of the organic material-based substrate in a thickness direction of the organic material-based substrate.